SAM9XE256 Atmel Corporation, SAM9XE256 Datasheet - Page 250

• Manufacturer Part Number: SAM9XE256
• Manufacturer: Atmel Corporation

Specifications of SAM9XE256

• Flash (kbytes): 256 Kbytes
• Pin Count: 217
• Max. Operating Frequency: 180 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 96
• Ext Interrupts: 96
• Usb Transceiver: 3
• Usb Speed: Full Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 2
• Uart: 6
• Ssc: 1
• Ethernet: 1
• Sd / Emmc: 1
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: Yes
• Adc Channels: 4
• Adc Resolution (bits): 10
• Adc Speed (ksps): 312
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 32
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.65 to 1.95
• Fpu: No
• Mpu / Mmu: No / Yes
• Timers: 6
• Output Compare Channels: 6
• Input Capture Channels: 6
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

24.5.5.3
6254C–ATARM–22-Jan-10
Deep Power-down Mode
This mode is selected by programming the LPCB field to 3 in the SDRAMC Low Power Register.
When this mode is activated, all internal voltage generators inside the SDRAM are stopped and
all data is lost.
When this mode is enabled, the application must not access to the SDRAM until a new initializa-
tion sequence is done (See
This is described in
Figure 24-8. Deep Power-down Mode Behavior
SDRAMC_A[12:0]
Figure
D[31:0]
AT91SAM9XE128/256/512 Preliminary
SDWE
(input)
SDCS
SDCK
CKE
RAS
CAS
24-8.
“SDRAM Device Initialization” on page
Row n
col c col d
Dnb
Dnc
Dnd
t
RP
= 3
242).
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