STTH812 STMicroelectronics, STTH812 Datasheet

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STTH812

Manufacturer Part Number
STTH812
Description
Ultrafast recovery -1200 V diode
Manufacturer
STMicroelectronics
Datasheet

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Main product characteristics
Features and benefits
Description
The high quality design of this diode has
produced a device with low leakage current,
regularly reproducible characteristics and intrinsic
ruggedness. These characteristics make it ideal
for heavy duty applications that demand long term
reliability.
Such demanding applications include industrial
power supplies, motor control, and similar
mission-critical systems that require rectification
and freewheeling. These diodes also fit into
auxiliary functions such as snubber, bootstrap,
and demagnetization applications.
The improved performance in low leakage current,
and therefore thermal runaway guard band, is an
immediate competitive advantage for this device.
March 2006
Ultrafast, soft recovery
Very low conduction and switching losses
High frequency and/or high pulsed current
operation
High reverse voltage capability
High junction temperature
Insulated packages:
– TO-220Ins
– TO-220FPAC
Electrical insulation = 2500 V
Capacitance = 7 pF
Electrical insulation = 2000 V
Capacitance = 12 pF
V
t
rr
V
I
F
F(AV)
RRM
(typ)
T
(typ)
j
1200 V
175° C
1.25 V
50 ns
RMS
RMS
8 A
Rev 1
Ultrafast recovery - 1200 V diode
Order codes
STTH812D
K
TO-220AC
STTH812G
STTH812G-TR
Part Number
STTH812FP
STTH812DI
STTH812G
STTH812D
D
NC
2
K
PAK
A
A
A
K
STTH812DI
www.st.com
STTH812
TO-220FPAC
TO-220Ins
STTH812FP
STTH812FP
STTH812DI
STTH812D
STTH812G
STTH812G
Marking
K
K
A
A
1/11
11

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STTH812 Summary of contents

Page 1

... Ultrafast recovery - 1200 V diode 8 A 1200 V 175° TO-220AC STTH812D PAK STTH812G RMS Order codes RMS Part Number STTH812D STTH812G STTH812G-TR STTH812FP STTH812DI Rev 1 STTH812 TO-220FPAC STTH812FP TO-220Ins STTH812DI Marking STTH812D STTH812G STTH812G STTH812FP STTH812DI 1/11 www.st.com 11 ...

Page 2

... RRM T = 125° 25° 125° 150° (RMS) STTH812 Value 1200 140° 75° 115° 100 80 - 175 175 Value 2 PAK 1.9 5.4 3 ...

Page 3

... STTH812 Table 4. Dynamic characteristics Symbol Parameter t Reverse recovery time rr I Reverse recovery current RM S Softness factor t Forward recovery time fr V Forward recovery voltage FP Figure 1. Conduction losses versus average current P(W) 20 δ = 0.1 δ = 0.2 δ (A) F(AV Figure 3. ...

Page 4

... Softness factor versus dI (typical values) dI /dt(A/µ 100 150 200 250 300 350 versus dI /dt (typical values) F (V) F(AV) dI /dt(A/µs) F 100 200 300 STTH812 / =600V R T =125°C j 400 450 500 /dt F ≤ I 2xI F F(AV) V =600V R T =125°C j 400 ...

Page 5

... STTH812 Figure 11. Forward recovery time versus dI (typical values) t (ns) fr 700 600 500 400 300 dI /dt(A/µs) F 200 0 100 200 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4 µ (°C/W) th(j- (cm² ...

Page 6

... Package mechanical data 2 Package mechanical data Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC) Maximum torque value: 0.7 Nm (TO-220AC) Table 5. T0-220AC dimensions 6/ Ø STTH812 DIMENSIONS REF. Millimeters Inches Min. Max. Min. A 4.40 4.60 0.173 C 1.23 1.32 0.048 D 2.40 2.72 0.094 E 0.49 0.70 0.019 F 0.61 ...

Page 7

... STTH812 Table 6. T0-220Ins dimensions B Ø REF Ø Package mechanical data DIMENSIONS Millimeters Inches Min. Max. Min. 15.20 15.90 0.598 3.75 0.147 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 4.80 5.40 0.189 6 ...

Page 8

... Package mechanical data Table 7. T0-220FPAC dimensions 8/ Dia STTH812 DIMENSIONS REF Millimeters Inches Min. Max. Min. A 4.4 4.6 0.173 B 2.5 2.7 0.098 D 2.5 2.75 0.098 E 0.45 0.70 0.018 F 0.75 1 0.030 F1 1.15 1.70 0.045 G 4.95 5.20 0.195 G1 2.4 2.7 0.094 H 10 10.4 0.393 L2 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 L4 9.8 10.6 0.386 L5 2.9 3.6 0.114 L6 15.9 16.4 0.626 L7 9.00 9.30 0.354 Dia ...

Page 9

... STTH812 2 Table 8. D PAK dimensions Figure 14. D PAK footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97 ...

Page 10

... Ordering information 3 Ordering information Part Number STTH812D STTH812DI STTH812FP STTH812G STTH812G-TR 4 Revision history Date 02-Mar-2006 10/11 Marking Package STTH812D TO-220AC STTH812DI TO-220Ins STTH812FP TO-220FPAC 2 STTH812G D PAK 2 STTH812G D PAK Revision 1 First issue. STTH812 Weight Base qty Delivery mode 1. Tube 1. Tube 2 Tube 1 ...

Page 11

... STTH812 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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