IDT72V2111 Integrated Device Technology, IDT72V2111 Datasheet - Page 26
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IDT72V2111
Manufacturer Part Number
IDT72V2111
Description
512k X 9 Supersync Fifo, 3.3v
Manufacturer
Integrated Device Technology
Datasheet
1.IDT72V2111.pdf
(27 pages)
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DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
greater than 262,144 and 524,288 for the IDT72V2111 with a 9-bit bus width.
In FWFT mode, the FIFOs can be connected in series (the data outputs of one
FIFO connected to the data inputs of the next) with no external logic necessary.
The resulting configuration provides a total depth equivalent to the sum of the
depths associated with each single FIFO. Figure 20 shows a depth expansion
using two IDT72V2101/72V2111 devices.
in the depth expansion configuration. The first word written to an empty
configuration will pass from one FIFO to the next ("ripple down") until it finally
appears at the outputs of the last FIFO in the chain–no read operation is
necessary but the RCLK of each FIFO must be free-running. Each time the
data word appears at the outputs of one FIFO, that device's OR line goes LOW,
enabling a write to the next FIFO in line.
the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's
outputs) after a word has been written to the first FIFO is the sum of the delays
for each individual FIFO:
where N is the number of FIFOs in the expansion and T
period. Note that extra cycles should be added for the possibility that the t
IDT72V2101/72V2111 3.3V HIGH DENSITY CMOS
SUPERSYNC FIFO
FWFT/SI
INPUT READY
DATA IN
WRITE CLOCK
WRITE ENABLE
The IDT72V2101 can easily be adapted to applications requiring depths
Care should be taken to select FWFT mode during Master Reset for all FIFOs
For an empty expansion configuration, the amount of time it takes for OR of
n
TM
(N – 1)*(4*transfer clock) + 3*T
262,144 x 9, 524,288 x 9
Dn
IR
WCLK
WEN
Figure 20. Block Diagram of 524,288 x 9 and 1,048,576 x 9 Depth Expansion
FWFT/SI
72V2101
72V2111
IDT
TRANSFER CLOCK
RCLK
RCLK
REN
OE
OR
Qn
RCLK
is the RCLK
SKEW1
GND
n
26
specification is not met between WCLK and transfer clock, or RCLK and transfer
clock, for the OR flag.
depth expansion configuration. There will be no delay evident for subsequent
words written to the configuration.
configuration will "bubble up" from the last FIFO to the previous one until it finally
moves into the first FIFO of the chain. Each time a free location is created in one
FIFO of the chain, that FIFO's IR line goes LOW, enabling the preceding FIFO
to write a word to fill it.
FIFO in the chain to go LOW after a word has been read from the last FIFO is
the sum of the delays for each individual FIFO:
where N is the number of FIFOs in the expansion and T
period. Note that extra cycles should be added for the possibility that the t
specification is not met between RCLK and transfer clock, or WCLK and transfer
clock, for the IR flag.
is faster. Both these actions result in data moving, as quickly as possible, to the
end of the chain and free locations to the beginning of the chain.
The "ripple down" delay is only noticeable for the first word written to an empty
The first free location created by reading from a full depth expansion
For a full expansion configuration, the amount of time it takes for IR of the first
The Transfer Clock line should be tied to either WCLK or RCLK, whichever
WCLK
IR
WEN
Dn
(N – 1)*(3*transfer clock) + 2 T
FWFT/SI
72V2101
72V2111
IDT
COMMERCIAL AND INDUSTRIAL
RCLK
REN
OR
Qn
OE
TEMPERATURE RANGES
WCLK
OUTPUT ENABLE
n
OUTPUT READY
WCLK
READ ENABLE
READ CLOCK
DATA OUT
is the WCLK
4669 drw 23
SKEW1