WM8310 Wolfson Microelectronics plc, WM8310 Datasheet - Page 10

• Manufacturer Part Number: WM8310
• Description: Processor Power Management Subsystem
• Manufacturer: Wolfson Microelectronics plc

WM8310
PACKAGE DIAGRAM
w
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS .
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’.
3. DIMENSION ‘b’ IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM -Z-.
4. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY .
6. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
8. FALLS WITHIN JEDEC, MO-195
2
Symbols
B: 169 BALL BGA PLASTIC PACKAGE 7
SIDE VIEW
DETAIL 2
REF:
bbb
ddd
aaa
ccc
A1
A2
D1
E1
A2
A
D
b
E
e
A
Tolerances of Form and Position
MIN
0.17
0.91
0.25
A
B
C
D
E
F
G
H
K
L
M
N
J
1
13
aaa
JEDEC, MO-195
12
bbb
Z
Z
11
7.00 BSC
6.00 BSC
7.00 BSC
6.00 BSC
0.50 BSC
Z
10
NOM
1.17
0.21
0.96
0.30
0.08
0.10
0.15
0.05
BOTTOM VIEW
A1
9
8
e
Dimensions (mm)
D1
7
6
5
MAX
1.27
0.26
1.01
0.35
4
DETAIL 2
3
X
2
7
DETAIL 1
X
1
1.17 mm BODY, 0.50 mm BALL PITCH
e
NOTE
6
6
E1
4
2 X
2 X
A1
CORNER
0.10
0.10
Z
Z
DETAIL 1
TOP VIEW
D
b
SOLDER BALL
5
Product Brief, July 2009, Rev 1.0
3
ccc
ddd
Z
Z
X
Y
DM062.B
E
Product Brief
10