EVX8AQ160TPY ETC-unknow, EVX8AQ160TPY Datasheet - Page 72

• Manufacturer Part Number: EVX8AQ160TPY
• Description: Adc Quad 1.25gsps 8-bit Lvds 380-pin Ebga
• Manufacturer: ETC-unknow

10.2
10.3
11. Quad ADC Application Information
11.1
72
EV8AQ160
Thermal Management Recommendations
Moisture Characteristics
Bypassing, Decoupling and Grounding
0846G–BDC–11/09
In still air and 25°C ambient temperature conditions, the maximum temperature for the device soldered
on the evaluation board is 67.4°C. In this environment, no cooling is necessary. In the case of the need
of an external thermal management, it is recommended to have an external heatsink on top of the
EBGA380 with a thermal resistance of 5°C/W max.
This device is sensitive to the moisture (MSL3 according to JEDEC standard). Shelf life in sealed bag:
12 months at <40°C and <90% relative humidity (RH). After this bag is opened, devices that will be sub-
jected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp.
220°C) must be:
Devices require baking, before mounting, if Humidity Indicator is >20% when read at 23
ing is required, devices may be baked for:
All power supplies have to be decoupled to ground as close as possible to the signal accesses to the
board by 1 µF in parallel to 100 nF.
Figure 11-1. EV8AQ160 Power supplies Decoupling and grounding Scheme
Note:
Each group of neighboring power supply pins attributed to the same value should be bypassed with at
least one pair of 100 pF in parallel to 10 nF capacitors. These capacitors should be placed as close as
possible to the power supply package pins.
The minimum required number of pairs of capacitors by power supply type is:
– Mounted within 168 hours at factory conditions of ≤30°C/60% RH, or
– Stored at ≤20% RH
– 192 hours at 40°C + 5°C/–0°C and <5% RH for low temperature device containers, or
– 24 hours at 125°C ± 5°C for high-temperature device containers
– 25 for V
– 2 for V
– 12 for V
External Power Supply Access
V
board.
CCD
and V
CCD
(V
CC
CCO
CC
CCO
, V CCD , V CCO )
planes should be separated but the two power supplies can be reunited by a strap on the
Ground
1 µF
100 nF
e2v semiconductors SAS 2009
Power supply
Plane
°
C ± 5°C. If bak-