S1F78100Y2A Epson Electronics America, Inc., S1F78100Y2A Datasheet - Page 239
S1F78100Y2A
Manufacturer Part Number
S1F78100Y2A
Description
High Precision Voltage Regulators
Manufacturer
Epson Electronics America, Inc.
Datasheet
1.S1F78100Y2A.pdf
(258 pages)
- Current page: 239 of 258
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ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings are the maximum physical
and electrical ratings of a device beyond which perfor-
mance degradation or damage will occur. Always
check circuit conditions before using a device to avoid
exceeding these ratings. Typically, absolute maximum
ratings include the following parameters.
1. Power supply voltage
2. Input signal voltage
3. Output current
4. Power dissipation
5. Operating temperature range
6. Storage temperature range
7. Soldering temperature and the duration
RECOMMENDED OPERATING
CONDITIONS
Recommended operating conditions are the conditions
under which a device functions correctly. These
include power supply voltage, input conditions and
output current. These conditions are sometimes listed
as part of the electrical characteristics.
ELECTRICAL CHARACTERISTICS
Electrical characteristics specify the DC and AC
characteristics of a device under the worst measure-
ment conditions.
S1F70000 Series
Technical Manual
Steady state applied voltages, noise, reverse voltage
transients and power-on-transients can degrade or
damage the integrated circuit if they exceed the
maximum power supply voltage rating.
Input signals exceeding this rate can damage input
protection circuits
Generally, specifications are not set for CMOS
devices with small output currents. Devices that
provide large drive currents will have output cur-
rent specifications.
The maximum power dissipation of a device is
limited by its construction and package type.
Maximum output current limits are set to prevent
thermal damage.
The temperature range for normal device operation
with no change in performance characteristics.
The temperature range for device storage with no
degradation or damage. This specification is par-
ticularly important when ICs are being transported
by air.
The maximum soldering temperature and the time
for which the leads can be at this temperature.
EPSON
POWER DISSIPATION CONDITIONS
To prevent damage always consider the following
points when designing with power regulation ICs.
1. A precise thermal design is necessary to ensure
adequate heat dissipation.
The following figure shows the power dissipation
capacity in relation to ambient temperature.
The following figure shows the cost and reliability
of a product and is significant when designing a
system.
3
2
1
0
0.5 mm thick substrate
25 x 80 x 0.7 mm
Ambient temperature (˚C)
Junction temperature
50
Cost
12.5 x 40 x 0.7 mm
ceramic substrate
Reliability
12.5 x 20 x 0.7 mm
ceramic substrate or
1.7 mm thick glass-epoxy
substrate with 1 cm
collector surface area
3
ceramic substrate
100
Appendix
3
3
2
150
7–1
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