MBM29LV320TE80TN Meet Spansion Inc., MBM29LV320TE80TN Datasheet - Page 64

• Manufacturer Part Number: MBM29LV320TE80TN
• Description: Flash Memory Cmos 32 M 4 M ? 8/2 M ? 16 Bit
• Manufacturer: Meet Spansion Inc.

64
MBM29LV320TE/BE
■ ORDERING INFORMATION
MBM29LV320TE80TN
MBM29LV320TE90TN
MBM29LV320TE10TN
MBM29LV320TE80TR
MBM29LV320TE90TR
MBM29LV320TE10TR
MBM29LV320TE80PBT
MBM29LV320TE90PBT
MBM29LV320TE10PBT
MBM29LV320BE80TN
MBM29LV320BE90TN
MBM29LV320BE10TN
MBM29LV320BE80TR
MBM29LV320BE90TR
MBM29LV320BE10TR
MBM29LV320BE80PBT
MBM29LV320BE90PBT
MBM29LV320BE10PBT
MBM29LV320
Part No.
T
DEVICE NUMBER/DESCRIPTION
MBM29LV320
32Mega-bit (4 M × 8-Bit or 2 M × 16-Bit) Flash Memory
3.0 V-only Read, Program, and Erase
E
80
48-pin plastic TSOP (1)
48-pin plastic TSOP (1)
48-pin plastic TSOP (1)
48-pin plastic TSOP (1)
63-pin plastic FBGA
63-pin plastic FBGA
Retired Product DS05-20894-5E_July 31, 2007
(BGA-63P-M01)
(BGA-63P-M01)
(FPT-48P-M19)
(FPT-48P-M20)
(FPT-48P-M19)
(FPT-48P-M20)
Reverse Bend
Reverse Bend
TN
Normal Bend
Normal Bend
80/90/10
Package
PACKAGE TYPE
TN =
TR =
PBT = 63-Ball Fine pitch Ball Grid Array
SPEED OPTION
See Product Selector Guide
DEVICE REVISION
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
48-Pin Thin Small Outline Package
48-Pin Thin Small Outline Package
Package (FBGA)
(TSOP) Normal Bend
(TSOP) Reverse Bend
Access Time(ns)
100
100
100
100
100
100
80
90
80
90
80
90
80
90
80
90
80
90
Bottom Sector
Top Sector
Remarks