SD3932_07 ST Microelectronics, Inc., SD3932_07 Datasheet
SD3932_07
Related parts for SD3932_07
SD3932_07 Summary of contents
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Features ■ Gold metallization ■ Excellent thermal stability ■ Common source push-pull configuration ■ 350 W min. OUT with 26.8 dB gain @ 123 MHz ■ In compliance with the 2002/95/EC european directive Description The SD3932 is a ...
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Contents Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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SD3932 1 Electrical data 1.1 Maximum ratings Table 2. Absolute maximum ratings (T Symbol (1) V Drain source voltage (BR)DSS V Drain-gate voltage (R DGR V Gate-source voltage GS I Drain current D P Power dissipation DISS T Max. operating ...
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Electrical characteristics 2 Electrical characteristics T = +25 CASE 2.1 Static Table 4. Static (per side) Symbol ( (BR)DSS DSS GSS GS V ...
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SD3932 3 Impedance data Figure 2. Impedance data Table 6. Impedance data Freq 123 MHz (800W Peak) 123 MHz (350W CW) Typical Input Impedance G Zin Z (Ω 5.5 0 3.9 Impedance data D ...
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Typical performance 4 Typical performance Figure 3. Capacitances vs voltage Figure 4. Transient thermal impedance 0.25 0.2 0.15 0.1 0.05 0 1.0E -04 6/14 1000 Coss 900 800 700 600 500 400 300 200 100 ...
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SD3932 Figure 5. Maximum safe operating area 100 Figure 6. Zero temperature coefficient point Operation limited ) by Rds( +25 ° ...
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Typical performance Figure 7. Pout & efficiency vs pin - CW 500 Pout Eff 450 400 350 300 250 200 150 100 50 0 0.0 0.5 Pin (W) Figure 9. Pout & efficiency vs pin power 1 msec - 10% ...
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SD3932 5 Test circuit Figure 11. Test circuit Table 7. Bill of materials Component C4 C10 C11 R1 FB1, FB2 B1 T1 TL1 TL2, TL3 Description 120 pF ...
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Circuit layout Table 7. Bill of materials (continued) Component TL4, TL5 TL6, TL7 TL8 TL9 Board 6 Circuit layout Figure 12. Circuit layout photo 10/14 Description .220" x .350" microstrip .350" x .660" microstrip .225" x .200" microstrip .175" x ...
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SD3932 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the ...
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Package mechanical data Table 8. M244 (.400 x .860 4/L BAL N/HERM W/FLG) mechanical data Dim Figure 13. Package dimensions Controlling Dimension: Inches 12/14 mm. Min ...
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SD3932 8 Revision history Table 9. Document revision history Date 09-Sep-2003 03-Jul-2007 07-Aug-2007 31-Oct-2007 Revision 1 First release 2 Specification upgrade 3 Updated: Cover page, Updated: Table 4: Static (per side) on page 4 4 Added Section 5: Test circuit ...
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Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any ...