L64733 LSI Logic Corporation, L64733 Datasheet - Page 42

• Manufacturer Part Number: L64733
• Description: Tuner/receiver Chipset
• Manufacturer: LSI Logic Corporation

Mechanical Drawing
Figure 15
42
e
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. Metal area of exposed die pad shall be within 0.3 mm of the nominal
A
0.09/0.20
M
All dimensioning and tolerancing conform to Ansi Y14.5–1982.
Datum
with lead, where lead exits plastic body at bottom of parting line.
Dimensions D1 and E1 do not include mold protrusion. allowable mold
protrusion is 0.254 mm on D1 and E1 dimensions.
The top of package is smaller than the bottom of package by
0.15 millimeters.
Dimension B does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08 mm total in excess of the B dimension at
maximum material condition.
Controlling dimension: millimeter.
Maximum allowable die thickness to be assembled in this package
family is 0.30 millimeters.
This outline conforms to Jedec Publication 95 Registration MO–136,
variations AC and AE.
Exposed die pad shall be coplanar with bottom of package within
2 mils (0.05 mm).
die pad size.
8 PLACES
11–13
plane – H – i
L64733 48-Pin TQFP Mechanical Drawing
b
TOP VIEW
b
1
D
SEE DETAIL “A”
A
s located at mold parting line and coincident
0.09/0.16
SEE DETAIL “B”
Figure 15
L64733/L64734 Tuner and Satellite Receiver Chipset
BASE METAL
WITH LEAD FINISH
D/2
E/2
E
is a mechanical drawing for the 48-pin TQFP L64733 package.
A2
A1
E1
DATUM
-H-
PLANE
E1/2
0.08 R. MIN.
0.20 MIN.
BOTTOM VIEW
1.00 REF.
DETAIL “B”
D1
D1/2
L
0 MIN.
A
A1
A2
D
D1
E
E1
L
M
b
b1
N
e
S
Y
M
B
O
L
0–7
0.08/0.20 R.
JEDEC VARIATION
0.25
MIN.
0.05
0.95
0.45
0.14
0.17
0.17
GAUGE PLANE
ALL DIMENSIONS IN MILLIMETERS
CORNER TAB DETAIL
9.00 BSC.
7.00 BSC.
9.00 BSC.
7.00 BSC.
EXPOSED PAD
0.5 BSC.
NOM.
0.10
1.00
0.60
0.22
0.20
AE
.50 MAX.
48
EVEN LEAD SIDES
DETAIL “A”
.15 MIN.
MAX.
1.20
0.15
1.05
0.75
0.27
0.23
e/2