MAX5874 Maxim Integrated Products, MAX5874 Datasheet - Page 2

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MAX5874

Manufacturer Part Number
MAX5874
Description
Dual DAC with LVDS Inputs
Manufacturer
Maxim Integrated Products
Datasheet

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ABSOLUTE MAXIMUM RATINGS
AV
AV
DACREF, REFIO, FSADJ to GND,
OUTIP, OUTIN, OUTQP,
CLKP, CLKN to GND, DACREF..............-0.3V to (AV
A13/B13–A0/B0, XOR, SELIQ to GND,
14-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
ELECTRICAL CHARACTERISTICS
(AV
ble-terminated, transformer-coupled output, I
+25°C.) (Note 2)
Note 1: Thermal resistors based on a multilayer board with 4 x 4 via array in exposed paddle area.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
STATIC PERFORMANCE
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Offset-Drift Tempco
Full-Scale Gain Error
Gain-Drift Tempco
Full-Scale Output Current
Output Compliance
Output Resistance
Output Capacitance
DYNAMIC PERFORMANCE
Clock Frequency
Output Update Rate
Noise Spectral Density
DACREF.......................................... -0.3V to (AV
OUTQN to GND, DACREF ....................-1V to (AV
DACREF...............................................-0.3V to (DV
DD1.8
DD3.3
DD3.3
_______________________________________________________________________________________
, DV
, DV
= DV
PARAMETER
DD1.8
DD3.3
DD3.3
, AV
to GND, DACREF ................. -0.3V to +2.16V
= AV
CLK
CLK
to GND, DACREF ....... -0.3V to +3.9V
= +3.3V, AV
SYMBOL
I
OUTFS
GE
R
C
f
DNL
f
INL
DAC
OS
CLK
OUT
OUT
DD1.8
FS
OUTFS
= DV
Measured differentially
Measured differentially
External reference
Internal reference
External reference
(Note 3)
Single-ended
f
f
f
f
DAC
DAC
DAC
DAC
DD3.3
DD3.3
DD3.3
CLK
= 20mA, T
DD1.8
= f
= f
= 150MHz
= 200MHz
+ 0.3V)
+ 0.3V)
+ 0.3V)
+ 0.3V)
CLK
CLK
= +1.8V, GND = 0, external reference V
, dual-port mode
/ 2, single-port mode
A
CONDITIONS
= T
f
f
MIN
OUT
OUT
TORB, DORI, PD to GND, DACREF ....-0.3V to (DV
Continuous Power Dissipation (T
Thermal Resistance θ
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
68-Pin QFN-EP
(derate 41.7mW/°C above +70°C) (Note 1) ............3333.3mW
to T
= 16MHz, -12dBFS
= 80MHz, -12dBFS
MAX
, unless otherwise noted. Typical values are at T
JA
(Note 1)...................................+24°C/W
REFIO
-0.025
MIN
-0.5
2
1
1
1
A
= +1.25V, output load 50Ω dou-
= +70°C)
±0.001
±100
±0.7
-160
-158
TYP
±10
±50
14
±1
±1
1
5
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+0.025
MAX
+1.1
200
100
200
20
DD3.3
dBFS/Hz
ppm/°C
ppm/°C
UNITS
+ 0.3V)
Msps
%FS
%FS
MHz
LSB
LSB
Bits
MΩ
mA
pF
V
A
=

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