LPC2104 Philips Semiconductors (Acquired by NXP), LPC2104 Datasheet - Page 31

• Manufacturer Part Number: LPC2104
• Description: LPC2104/2105/2106; Single-chip 32-bit Microcontrollers; 128 KB Isp/iap Flash With 64 KB/32 KB/16 KB RAM;; Package: SOT313-2 (LQFP48)
• Manufacturer: Philips Semiconductors (Acquired by NXP)

Philips Semiconductors
9397 750 11499
Product data
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These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Rev. 02 — 11 June 2003
LPC2104/2105/2106
10 C measured in the atmosphere of the reflow
Single-chip 32-bit microcontrollers
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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