MT55L128L32P1 Micron Semiconductor Products, Inc., MT55L128L32P1 Datasheet - Page 10

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MT55L128L32P1

Manufacturer Part Number
MT55L128L32P1
Description
4Mb ZBT SRAM, 3.3V Vdd, 3.3V or 2.5V I/O, Pipelined,
Manufacturer
Micron Semiconductor Products, Inc.
Datasheet

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FBGA PIN DESCRIPTIONS (continued)
10L, 10M, 11D, 10L, 10M, 11J,
4Mb: 256K x 18, 128K x 32/36 Pipelined ZBT SRAM
MT55L256L18P1_F.p65 – Rev. F, Pub. 1/03 EN
11E, 11F, 11G 11K, 11L, 11M
(a)
1L, 1M, 2D,
1H, 2H, 4D,
4L, 4M, 7N,
3K, 3L, 3M,
3N, 9C, 9D,
8G, 8H, 8J,
8K, 8L, 8M
3C, 3D, 3E,
4E, 4F, 4G,
4H, 4J, 4K,
8D, 8E, 8F,
9E, 9F, 9G,
3F, 3G, 3J,
9J, 9K, 9L,
(b)
2E, 2F, 2G
9M, 9N
10J, 10K,
x18
11C
8A
1J, 1K,
1N
1R
10F, 10G, 11D,
11E, 11F, 11G
(d)
(b)
(a)
1H, 2H, 4D,
4L, 4M, 7N,
3K, 3L, 3M,
3N, 9C, 9D,
1F, 1G, 2D,
1M, 2J, 2K,
8G, 8H, 8J,
8K, 8L, 8M
3C, 3D, 3E,
4E, 4F, 4G,
4H, 4J, 4K,
8D, 8E, 8F,
9E, 9F, 9G,
3F, 3G, 3J,
9J, 9K, 9L,
2E, 2F, 2G
(c)
x32/x36
9M, 9N
2L, 2M
1J, 1K, 1L,
10D, 10E,
10J, 10K,
11N
11C
1D, 1E,
8A
1N
1R
1C
ADV/LD# Input Synchronous Address Advance/Load: When HIGH, this input is
SYMBOL
NC/DQPb
NC/DQPd
NC/DQPa
NC/DQPc
MODE
(LB0#)
V
DQb
DQd
DQa
DQc
V
DD
DD
Q
Output Byte “b” is associated with DQb’s. For the x32 and x36 versions,
Supply Power Supply: See DC Electrical Characteristics and Operating
Supply Isolated Output Buffer Supply: See DC Electrical Characteristics and
Input/ SRAM Data I/Os: For the x18 version, Byte “a” is associated DQa’s;
TYPE
Input
NC/
I/O
(continued on next page)
used to advance the internal burst counter, controlling burst
access after the external address is loaded. When ADV/LD# is
HIGH, R/W# is ignored. A LOW on ADV/LD# clocks a new
address at the CLK rising edge.
Mode: This input selects the burst sequence. A LOW on this input
selects “linear burst.” NC or HIGH on this input selects “interleaved
burst.” Do not alter input state while device is operating.
Byte “a” is associated with DQa’s; Byte “b” is associated with DQb's;
Byte “c” is associated with DQc’s; Byte “d” is associated with DQd’s.
Input data must meet setup and hold times around the rising edge
of CLK.
No Connect/Parity Data I/Os: On the x32 version, these are No
Connect (NC). On the x18 version, Byte “a” parity is DQPa; Byte “b”
parity is DQPb. On the x36 version, Byte “a” parity is DQPa; Byte
“b” parity is DQPb; Byte “c” parity is DQPc; Byte “d” parity is DQPd.
Conditions for range.
Operating Conditions for range.
10
4Mb: 256K x 18, 128K x 32/36
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DESCRIPTION
PIPELINED ZBT SRAM
©2003, Micron Technology, Inc.

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