ISL12026 Intersil Corporation, ISL12026 Datasheet - Page 3

• Manufacturer Part Number: ISL12026
• Manufacturer: Intersil Corporation

Absolute Maximum Ratings
Voltage on V
Voltage on X1 and X2 Pins
ESD Rating (MIL-STD-883, Method 3014) . . . . . . . . . . . . . . .>±2kV
ESD Rating (Machine Model) . . . . . . . . . . . . . . . . . . . . . . . . .>175V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: θ
DC Operating Specifications
Electrical Specifications
EEPROM Specifications
IRQ/F
SYMBOL
SYMBOL
V
SYMBOL
V
(respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V
(respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 2.5V
I
V
BATLKG
TRIPHYS
V
BATHYS
V
DD SR-
V
I
I
I
I
V
DD1
DD2
DD3
I
BAT
TRIP
BAT
LO
DD
OL
OUT
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
DD
Main Power Supply
Backup Power Supply
Supply Current with I
Supply Current for Non-Volatile
Programming
Supply Current for Main
Timekeeping (Low Power Mode)
Battery Supply Current
Battery Input Leakage
V
V
V
V
Output Low Voltage
Output Leakage Current
EEPROM Endurance
EEPROM Retention
BAT
TRIP
BAT
DD
, V
BAT
Negative Slew Rate
Mode Threshold
Hysteresis
Hysteresis
, SCL, SDA, and
PARAMETER
PARAMETER
PARAMETER
3
2
C Active
IRQ/F
Unless otherwise noted, V
V
DD
= 3.3V
OUT Pins
V
V
V
V
V
V
V
V
V
V
V
V
I
V
I
V
V
Temperature ≤75°C
OL
OL
DD
DD
DD
DD
DD
DD
BAT
DD
BAT
DD
DD
DD
DD
DD
OUT
= 3mA
= 1mA
= V
= V
= 2.7V
= 5.5V
= 2.7V
= 5.5V
= V
= V
= 5.5V, V
= 5V
= 1.8V
= 5.5V
= 1.8V,
= 3.0V,
= 5.5V
TEST CONDITIONS
SDA
SDA
SDA
SDA
CONDITIONS
CONDITIONS
= V
= V
= V
= V
BAT
ISL12026
SCL
SCL
DD
SCL
SCL
= 1.8V
= +2.7V to +5.5V, T
= V
= V
= 2.7V
= 5.5V
RESET
RESET
Thermal Information
Thermal Resistance (Note)
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . . 300°C
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
8 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . .
= 0
= 0
>2,000,000
A
MIN
MIN
MIN
2.7
1.8
1.8
50
= -40°C to +85°C, Typical values are @ T
TYP
TYP
TYP
800
850
100
2.2
30
50
MAX
MAX
1000
1200
MAX
500
800
100
400
5.5
5.5
2.5
3.5
2.6
0.4
0.4
10
20
10
UNITS
Cycles
Years
UNIT
UNIT
V/ms
mA
mA
mV
mV
µA
µA
µA
µA
nA
nA
nA
nA
V
V
V
V
V
A
= 25°C and
θ
April 13, 2006
JA
NOTES
NOTES
NOTES
1, 2, 3
1, 2, 3
1, 4, 5
5, 8
5, 8
120
140
FN8231.3
(°C/W)
3
5
6