MD4331-Dxx M-Systems, MD4331-Dxx Datasheet
MD4331-Dxx
Manufacturer Part Number
MD4331-Dxx
Description
Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk
Manufacturer
M-Systems
Datasheet
1.MD4331-DXX.pdf
(96 pages)
www.DataSheet4U.com
Highlights
Mobile DiskOnChip G3 is one of the industry’s
most efficient storage solutions, using
Toshiba’s 0.13 µm Multi-Level Cell (MLC)
NAND flash technology and x2 technology
from M-Systems®. MLC NAND flash
technology provides the smallest die size by
storing 2 bits of information in a single memory
cell. x2 technology enables MLC NAND to
achieve highly reliable, high-performance data
and code storage with a specially designed error
detection and correction mechanism, optimized
file management, and proprietary algorithms for
enhanced performance.
Further cost benefits derive from the
cost-effective architecture of Mobile
DiskOnChip G3, which includes a boot block
that can replace expensive NOR flash, and
incorporates both the flash array and an
embedded thin controller in a single die.
Mobile DiskOnChip G3 provides:
1
Flash disk for both code and data storage
Low voltage: 1.8V or 3.3 I/O (auto-detect),
3V Core
Hardware protection and security-enabling
features
High capacity: single die - 512Mb (64MB),
dual die - 1Gb (128MB)
Device cascade capacity: up to 2Gb
(256MB)
512Mbit/1Gbit Flash Disk with MLC NAND and
Mobile DiskOnChip G3
M-Systems’ x2 Technology
Preliminary Data Sheet, Rev. 1.0
Enhanced Programmable Boot Block
enabling eXecute In Place (XIP)
functionality using 16-bit interface
Small form factors:
512Mb (64MB) capacity (single die):
Enhanced performance by implementation
of:
Unrivaled data integrity with a robust Error
Detection Code/Error Correction Code
(EDC/ECC) tailored for MLC NAND flash
technology
Maximized flash endurance with TrueFFS
6.1 (and higher)
Support for major mobile operating systems
(OSs), including Symbian OS, Pocket PC
2002/3, Smartphone 2002/3, Palm OS,
Nucleus, Linux, Windows CE, and more.
Compatible with major mobile CPUs,
including TI OMAP, XScale, Motorola
DragonBall MX1 and Qualcomm
MSMxxxx.
48-pin TSOP-I package
85-ball FBGA 7x10 mm package
1Gb (128MB) capacity (dual die):
69-ball FBGA 9x12 mm package
Multi-plane operation
DMA support
MultiBurst operation
Turbo operation
Preliminary Data Sheet, June 2003
91-SR-011-05-8L
®
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