BAT62-09S Infineon Technologies Corporation, BAT62-09S Datasheet
BAT62-09S
Related parts for BAT62-09S
BAT62-09S Summary of contents
Page 1
... Pb-containing package may be available upon special request 1) BAT62-07W Package Configuration SOT143 anti-parallel pair TSLP-2-1 single, leadless TSSLP-2-1 single, leadless SCD80 single SOD323 single TSLP-4-4 parallel pair, leadless SOT343 parallel pair SOT363 parallel pair, high isolation 1 BAT62... BAT62-09S BAT62-02L BAT62-02LS 1 L Marking (nH 62s 0.4 L 0.2 U 0.6 62 1.8 L 0.4 62 1.8 62s 1.6 ...
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... Parameter Diode reverse voltage Forward current Total power dissipation BAT62 °C S BAT62-02L, -07L4, -03W, T BAT62-02W, T 109 °C S BAT62-07W, T 103 °C S BAT62-09S, T 105 °C S Junction temperature Storage temperature Thermal Resistance Parameter 1) Junction - soldering point BAT62 BAT62-02L, -07L4, -03W BAT62-02W BAT62-07W BAT62-09S ...
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... Electrical Characteristics at T Parameter AC Characteristics Diode capacitance MHz R Differential resistance kHz R = 25°C, unless otherwise specified A Symbol BAT62... Values Unit min. typ. max. - 0.35 0 225 - k 2007-04-19 ...
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... Forward current I F BAT62 22 mA 25°C 85°C 18 125° 1 1 105 120 ° 2007-04-19 BAT62... 125°C 85°C 25° 150 T S ...
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... Forward current BAT62-02L, -07L4 Forward current BAT62-03W Forward current I BAT62-02W 105 120 °C 150 ...
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... Permissible Pulse Load Fmax FDC BAT62 Permissible Pulse Load Fmax FDC BAT62-02L, -07L4 BAT62... = ( D=0 0.005 0.01 0.02 0.05 0.1 0.2 0 ...
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... Permissible Pulse Load Fmax BAT62-02W Permissible Pulse Load Fmax BAT62-03W BAT62... = (t ) FDC 0.005 0.01 0.02 0.05 0.1 0.2 0 FDC p D=0 0.005 0.01 0.02 0.05 0.1 0.2 0 ...
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... Permissible Pulse Load Fmax BAT62-07W Testcircuit BAT62... = (t ) FDC 0.005 0.01 0.02 0.05 0.1 0.2 0 D.U 1nF 2007-04- ...
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... Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Cathode marking Package SCD80 0 +0.05 0.13 0.8 ±0.1 -0. 0.3 ±0.05 0.7 ±0.1 0.35 Reel with 2 mm Pitch 2 0.4 Cathode marking 0.9 9 BAT62... A 2005, June Date code BAR63-02W Type code Cathode marking Laser marking 0.2 0.7 2007-04-19 ...
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... BAT62... ...
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... Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Cathode marking Package SOD323 +0.2 0.9 -0.1 +0.2 1.25 0 -0.1 ±0.05 2 Cathode marking 1 +0.1 0.3 -0.05 0.15 0. 0.6 BAR63-03W Type code Cathode marking Laser marking 0.2 4 0.65 1 1.35 11 BAT62... A +0.05 0.3 -0.2 +0.1 -0.06 2007-04-19 ...
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... Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Package SOT143 2.9 ±0 0.2 +0.1 0.8 -0.05 +0.1 0.4 -0.05 0. 1.7 0.8 1.2 0.8 1.2 0.8 0.8 Manufacturer RF s 2005, June Date code (YM) Pin 1 BFP181 Type code 4 3.15 Pin 1 12 BAT62... 1 ±0.1 0.1 MAX 0.2 1.15 2007-04-19 ...
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... Package Outline +0.1 0.3 -0.05 4x 0.1 Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT343 2 ±0.2 0.1 MAX. 1 +0.1 0.6 -0.05 0 0.6 1.15 0.9 Manufacturer 2005, June Date code (YM) BGA420 Pin 1 Type code 0.2 4 2.15 1.1 13 BAT62... 0.9 ±0.1 A +0.1 0.15 -0.05 A 2007-04-19 ...
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... Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel. ackage SOT363 P 2 ±0.2 +0.1 6x 0.2 0.1 MAX. -0.05 0 0.65 0.65 0 0.3 0.65 0.65 Manufacturer 2005, June Date code (Year/Month) BCR108S Type code 4 2.15 Pin 1 marking 14 BAT62... 0.9 ±0.1 A +0.1 0.15 -0.05 0.2 1.1 2007-04-19 ...
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... For board assembly information please refer to Infineon website "Packages" Copper Marking Layout (Example) Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) Cathode marking Package TSLP-2-1 +0.1 0.4 0.05 MAX. 0.5 ±0.035 0.6 0.45 Solder mask Stencil apertures BAS16-02L Type code Cathode marking Laser marking 0.5 4 0.76 15 BAT62... Bottom view 0.6 ±0. 2007-04-19 ...
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... For board assembly information please refer to Infineon website "Packages" 0.3 Marking Layout (Example) Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Package TSLP-4-4 +0.01 0 0.25 0.05 MAX. 0.8 0.3 0.2 Copper Solder mask 0.5 4 Pin 1 1.05 marking 16 BAT62... Bottom view 0.8 ±0.05 1) ±0.035 0.45 ±0.05 0.78 0.28 0.28 0.22 Stencil apertures BAR90-07L4 Type code Pin 1 marking Laser marking ...
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... For board assembly information please refer to Infineon website "Packages" Copper Mar king Layout Standard Pa cking Reel ø180 mm = 15.000 Pieces/Reel Package TSSLP-2-1 +0.01 0.31 -0.02 0.26 ±0.025 0.32 0.27 Solder mask Stencil apertures BAR95-02LS Type code Pin 1 marking Laser marking 4 0.43 Cathode marking 17 BAT62... Bottom view 0.32 ±0.035 0.35 2007-04-19 ...
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... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. 18 BAT62... 2007-04-19 ...