BAP55L Philips Semiconductors (Acquired by NXP), BAP55L Datasheet - Page 5

• Manufacturer Part Number: BAP55L
• Manufacturer: Philips Semiconductors (Acquired by NXP)

Philips Semiconductors
8. Package outline
Fig 5. Package outline SOD882
9397 750 14811
Preliminary data sheet
Leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Including plating thickness
2. The marking bar indicates the cathode
UNIT
mm
VERSION
OUTLINE
SOD882
A
0.50
0.46
(1)
max.
0.03
A
1
0.55
0.47
1
b
IEC
0.62
0.55
D
(2)
L
1.02
0.95
E
0.65
e
1
JEDEC
e 1
E
0.30
0.22
L
REFERENCES
Rev. 01 — 5 April 2005
L
JEITA
2
A 1
D
b
A
0
PROJECTION
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
EUROPEAN
scale
0.5
Silicon PIN diode
BAP55L
ISSUE DATE
03-04-16
03-04-17
1 mm
SOD882
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