LM3S317-IQN20-A0T Luminary Micro, Inc., LM3S317-IQN20-A0T Datasheet - Page 372
![no-image](/images/no-image-200.jpg)
LM3S317-IQN20-A0T
Manufacturer Part Number
LM3S317-IQN20-A0T
Description
Microcontroller
Manufacturer
Luminary Micro, Inc.
Datasheet
1.LM3S317-IQN20-A0T.pdf
(379 pages)
- Current page: 372 of 379
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Package Information
20
Figure 20-1. 48-Pin LQFP Package
372
aaa
bbb
ddd
ccc
A1
A2
D1
E1
b1
c1
D
A
E
L
e
b
c
Package Information
ddd
MIN
0.05
1.35
0.45
0.17
0.17
0.09
0.09
===
aaa
Tolerances of form and position
ccc
PACKAGE TYPE
48LD LQFP
NOM
1.40
0.80
0.22
0.20
===
===
===
===
9.00 BSC
7.00 BSC
9.00 BSC
7.00 BSC
0.50 BSC
0.20
0.20
0.08
0.08
MAX
1.60
0.15
1.45
0.75
0.27
0.23
0.20
0.16
Preliminary
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. Corner radius of plastic body does not exceed 0.20.
11.
12. A1 is defined as the distance from the seating plane to the
13. Finish of leads is tin plated.
14. All specifications and dimensions are subjected to IPAC’S
15. The packages described in the drawing conform to JEDEC
All dimensions are in mm. All dimensioning and tolerancing
conform to ANSI Y14.5M-1982.
The top package body size may be smaller than the bottom
package body size by as much as 0.20.
Datums
To be determined at seating plane
Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25 per side. D1 and E1 are
maximum plastic body size dimensions including mold
mismatch.
Surface finish of the package is #24-27 Charmille
(1.6-2.3µmR
0.1µmR
Dambar removal protrusion does not exceed 0.08. Intrusion
does not exceed 0.03.
Burr does not exceed 0.08 in any direction.
Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall not cause the lead width
to exceed the maximum b dimension by more than 0.08.
Dambar cannot be located on the lower radius or the foot.
Minimum space between protrusion and adjacent lead is
0.07 for 0.40 and 0.50 pitch package.
These dimensions apply to the flat section of the lead
between 0.10 and 0.25 from the lead tip.
lowest point of the package body.
manufacturing process flow and materials.
M5-026A. Where discrepancies between the JEDEC and
IPAC documents exist, this drawing will take the
precedence.
bbb
0
A-B
.
0
and
) Pin 1 and ejector pin may be less than
-D-
to be determined at datum plane
-C-
.
May 4, 2007
-H-
.
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