DS21348 Dallas Semiconducotr, DS21348 Datasheet - Page 60

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DS21348

Manufacturer Part Number
DS21348
Description
3.3V E1/T1/J1 Line Interface
Manufacturer
Dallas Semiconducotr
Datasheet

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THERMAL CHARACTERISTICS OF DS21Q48 BGA PACKAGE
Ambient Temperature
Junction Temperature
Theta-JA (θ
Theta-JC (θ
NOTES:
1) The package is mounted on a four-layer JEDEC-standard test board.
2) Theta-JA (θ
3) While Theta-JC (θ
THETA-JA (θ
FORCED AIR (m/s)
layer JEDEC-standard test board.
junction temperature (T
packages (T
The method of measurement of the thermal parameters is defined in EIA/JEDEC-standard document
EIA-JESD51-2.
PARAMETER
2.5
0
1
JC
JA
) in Still Air
) in Still Air
JA
C
), the proper term is Psi-JT. It is defined by:
) is the junction to ambient thermal resistance, when the package is mounted on a four-
JA
) VERSUS AIRFLOW
JC
) is commonly used as the thermal parameter that provides a correlation between the
j
THETA-JA (θ
) and the average temperature on top center of four of the chip-scale BGA
(T
J
24ºC/W
21ºC/W
19ºC/W
- T
C
) / overall package power
-40ºC
MIN
-
-
-
JA
)
+4.1ºC/W
+24ºC/W
TYP
60 of 73
-
-
+125ºC
+85ºC
MAX
-
-
NOTES
1
2
3

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