AN1902 Freescale Semiconductor / Motorola, AN1902 Datasheet - Page 22

• Manufacturer Part Number: AN1902
• Description: Quad Flat Pack No-Lead (QFN)
• Manufacturer: Freescale Semiconductor / Motorola

AN1902/D
6.0 MOISTURE SENSITIVITY LEVEL RATING
7.0 BOARD LEVEL RELIABILITY
22
The Moisture Sensitivity Level (MSL) indicates the floor life of the component and its
storage conditions after the original container has been opened. The lower the MSL
value, the less care is needed to store the components. The QFN MSL reliability is
dependent upon the different supplier material set and package size.
the best case MSL for each package size at the time of document release.
The board level reliability is usually presented in terms of solder joint life. The solder
joint results in this section utilized the board layout guidelines from Section 4.1.2.
7.1 Testing Details
The QFN package has a relatively short solder joint life compared to leaded pack-
ages. The solder joint reliability has been tested for reliability by Motorola to under-
stand solder joint life and failure mechanism. The result is in terms of Time to First
Failure (TFF) and Mean Time to Failure (MTTF) values.
Freescale Semiconductor, Inc.
For More Information On This Product,
Quad Flat Pack No-Lead (QFN)
Go to: www.freescale.com
4x4 (EP)
4x4 (EP)
4x4 (EP)
5x5 (EP)
5x5 (EP)
7x7 (EP)
7x7 (EP)
7x7 (EP)
8x8
9x9 (EP)
Pkg Size
(mm)
Table 6 MSL on QFN Package
Pitch
(mm)
0.65
0.50
0.50
0.65
0.50
0.65
0.50
0.50
0.50
0.65
Count
Lead
16
20
24
20
32
32
44
48
56
44
1@ 240°C
1@ 240°C
1@ 240°C
1@ 240°C
1@ 240°C
1@ 240°C
2@ 260°C
1@ 240°C
2@ 260°C
1@ 240°C
2@ 260°C
2@ 260°C
2@ 240°C
MSL
Table 6
MOTOROLA
depicts