AN1902 Freescale Semiconductor / Motorola, AN1902 Datasheet - Page 4

• Manufacturer Part Number: AN1902
• Description: Quad Flat Pack No-Lead (QFN)
• Manufacturer: Freescale Semiconductor / Motorola

Freescale Semiconductor, Inc.
AN1902/D
3.3.2.2 MAP QFN: “S” Style
The “S” style is a Motorola version based on JEDEC MO-220 with an exception in the
lead end feature. The lead end is slightly recessed from the package perimeter due to
a ½ etched leadframe. No solder fillet is expected after the solder reflow process (See
Figure
4).
Figure 4 MAP QFN "S" Version [2]: Left-Bottom View, Right-Tilted to Show Side
& Bottom Views
3.3.3 Punch Singulated QFN
The punch singulated QFN is also a JEDEC compliant design. The bottom lead por-
tion of the package protrudes outwards compared to the top portion, leaving a ledge
for solder fillet (See
Figure
5).
Figure 5 Punch Singulated QFN [3]
3.4 Process Flow
3.4.1 QFN Package Process Flow
The MAP style QFN package process flow is illustrated in
Figure
6. The illustration
displays the difference between the Quad Flat Pack (QFP) and QFN process flows.
The QFN package process flow is dependent upon the material set and factory. The
Motorola MAP style QFN is assembled using pre-plated NiPdAu leadframes and
doesn’t require any post plating process. For the punch singulated QFN process, the
tape and de-taping operations displayed in
Figure 6
are not required.
4
Quad Flat Pack No-Lead (QFN)
MOTOROLA
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