LTC3642 Linear Technology, LTC3642 Datasheet - Page 18
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LTC3642
Manufacturer Part Number
LTC3642
Description
High Voltage 50mA Synchronous Step-Down Converter
Manufacturer
Linear Technology
Datasheet
1.LTC3642.pdf
(20 pages)
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www.DataSheet4U.com
PACKAGE DESCRIPTION
LTC3642
18
3.5 0.05
2.15 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
1.65 0.05
(2 SIDES)
(NOTE 6)
0.25 0.05
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
2.38 0.05
(2 SIDES)
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.50
BSC
DD Package
0.675 0.05
0.75 0.05
3.00 0.10
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.25 0.05
R = 0.115
TYP
4
5
2.38 0.10
(2 SIDES)
8
1
0.50 BSC
0.38 0.10
(DD) DFN 1203
3642f