S29WS128J SPANSION, S29WS128J Datasheet - Page 96

• Manufacturer Part Number: S29WS128J
• Description: (S29WS064J / S29WS128J) Burst Mode Flash Memory
• Manufacturer: SPANSION

96
PACKAGE
JEDEC
SYMBOL
SD / SE
MD
ME
A1
A2
D1
E1
φb
A
D
E
N
e
A
VBR080 - 80-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm (64Mb)
0.15
(2X)
A1
MIN
0.17
0.62
0.35
9.00 mm x 7.00 mm NOM
---
C
INDEX MARK
A1 CORNER
PACKAGE
9.00 BSC.
7.00 BSC.
7.20 BSC.
5.60 BSC.
0.80 BSC.
0.40 BSC.
VBR 080
NONE
NOM
N/A
- --
---
---
10
80
---
8
SIDE VIEW
TOP VIEW
MAX
10
1.00
0.73
0.45
---
D
SEATING PLANE
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
A2
S29WS128J/064J
A
0.15
(2X)
E
C
B
C
D a t a
e
0.08
0.20 C
NXφb
6
C
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
S h e e t
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
φ 0.08 M
φ 0.15
e REPRESENTS THE SOLDER BALL GRID PITCH.
K
M
J
C
C A
H
BOTTOM VIEW
B
e
G
F
D1
E
SD
D
C
7
B
A
S29WS-J_00_A4 June 24, 2005
8
7
6
5
4
3
2
1
A1 CORNER
SE
7
3366 \ 16-038.25d1
E1