SC16IS762 Philips Semiconductors, SC16IS762 Datasheet - Page 56
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SC16IS762
Manufacturer Part Number
SC16IS762
Description
(SC16IS752 / SC16IS762) Dual UART
Manufacturer
Philips Semiconductors
Datasheet
1.SC16IS762.pdf
(59 pages)
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18. Abbreviations
SC16IS752_SC16IS762_6
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 42.
Acronym
CPU
DLL
DLH
FIFO
GPIO
I
IrDA
LCD
MIR
POR
SIR
SPI
SPR
UART
2
Fig 39. Temperature profiles for large and small components
C-bus
MSL: Moisture Sensitivity Level
temperature
Abbreviations
Description
Central Processing Unit
Divisor Latch LSB
Divisor Latch MSB
First In, First Out
General Purpose Input/Output
Inter IC bus
Infrared Data Association
Liquid Crystal Display
Medium InfraRed
Power-On Reset
Serial InfraRed
Serial Peripheral Interface
ScratchPad Register
Universal Asynchronous Receiver/Transmitter
Rev. 06 — 19 December 2006
Dual UART with I
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
2
SC16IS752/SC16IS762
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
temperature
peak
© NXP B.V. 2006. All rights reserved.
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