TIM4450-60SL Toshiba Semiconductor, TIM4450-60SL Datasheet

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TIM4450-60SL

Manufacturer Part Number
TIM4450-60SL
Description
LOW INTERMODULATION DISTORTION
Manufacturer
Toshiba Semiconductor
Datasheet

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‹ The information contained herein is presented only as a guide for the applications of our products. No responsibility is
MICROWAVE SEMICONDUCTOR
TECHNICAL DATA
T T T T LOW INTERMODULATION DISTORTION
T T T T HIGH POWER
RF PERFORMANCE SPECIFICATIONS ( Ta= 25 C )
ELECTRICAL CHARACTERISTICS ( Ta= 25 C )
Output Power at 1dB Gain
Compression Point
Power Gain at 1dB Gain
Compression Point
Drain Current
Gain Flatness
Power Added Efficiency
3rd Order Intermodulation
Distortion
Drain Current
Channel Temperature Rise
Recommended Gate Resistance(Rg) : 28
Transconductance
Pinch-off Voltage
Saturated Drain Current
Gate-Source Breakdown
Voltage
Thermal Resistance
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
FEATURES
FEATURES
FEATURES
FEATURES
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
IM3=-45 dBc at Pout= 36.5dBm
Single Carrier Level
P1dB=48.0dBm at 4.4GHz to 5.0GHz
CHARACTERISTICS
CHARACTERISTICS
SYMBOL
SYMBOL
R
V
V
G
P
I
I
I
th(c-c)
IM
GSoff
DSS
DS1
DS2
gm
GSO
Tch
1dB
1dB
add
G
3
V
V
I
V
I
V
V
I
Channel to Case
(Single Carrier Level)
DS
DS
GS
DS
DS
DS
DS
GS
f = 4.4 to 5.0GHz
Two-Tone Test
(Max.)
CONDITIONS
CONDITIONS
= 12.0A
= 200mA
Po=36.5dBm
= -1.0mA
I
= 3V
=
=
= 0V
DS
X I
T T T T HIGH GAIN
T T T T BROAD BAND INTERNALLY MATCHED FET
T T T T HERMETICALLY SEALED PACKAGE
V
3V
3V
DS
G1dB=9.5dB at 4.4GHz to 5.0GHz
set 9.5A
DS
MICROWAVE POWER GaAs FET
= 10V
X R
TIM4450-60SL
th(c-c)
UNIT
UNIT
dBm
dBc
C/W
dB
dB
%
A
A
S
V
A
V
C
MIN.
MIN.
47.0
-1.0
-42
8.5
-5
TYP. MAX.
Rev. Aug. 2003
48.0
13.2
TYP. MAX.
-45
9.5
-1.8
42
0.6
20
38
15.0
11.8
100
-3.0
0.8
0.8

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TIM4450-60SL Summary of contents

Page 1

... The information contained herein is subject to change without prior notice therefor advisable to contact TOSHIBA before proceeding with design of equipment incorporating this product. MICROWAVE POWER GaAs FET TIM4450-60SL HIGH GAIN G1dB=9.5dB at 4.4GHz to 5.0GHz BROAD BAND INTERNALLY MATCHED FET ...

Page 2

... Drain Current Total Power Dissipation (Tc Channel Temperature Storage Temperature PACKAGE OUTLINE (2-16G1B) 4 – – – – C1 HANDLING PRECAUTIONS FOR PACKAGE MODEL Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260 C. TIM4450-60SL SYMBOL ...

Page 3

... RF PERFORMANCE Output Power (P V =10V 13. =38.5dBm 4.4 Output Power(P 51 freq.=5.0GHz 50 V =10V DS I set 9. TIM4450-60SL ) vs. Frequency out 4.5 4.6 4.7 4.8 Frequency(GHz) ) vs. Input Power(Pi out Pout add 36 38 Pin(dBm) 3 4.9 5 ...

Page 4

... Power Dissipation(PT) vs. Case Temperature(Tc) 220 180 140 100 IM3 vs. Power Characteristics -10 V =10V DS I set 9.5A DS freq.=5.0GHz -20 f=5MHz -30 -40 -50 - Pout(dBm) @Single carrier level TIM4450-60SL 80 120 Tc 200 160 40 42 ...

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