cef830g Hope Microelectronics co., Ltd, cef830g Datasheet - Page 51
cef830g
Manufacturer Part Number
cef830g
Description
Rf42/43 Ism Transmitter
Manufacturer
Hope Microelectronics co., Ltd
Datasheet
1.CEF830G.pdf
(113 pages)
- Current page: 51 of 113
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10. Application Notes
10.1. Crystal Selection
The recommended crystal parameters are given in Table 16.
The internal XTAL oscillator will work over a range for the parameters of ESR, CL, C0, and ppm accuracy. Extreme
values may affect the XTAL start-up and sensitivity of the link. For questions regarding the use of a crystal
parameters greatly deviating from the recommend values listed above, please contact customer support.
The crystal used for engineering evaluation.
10.2. Layout Practice
The following are some general best practice guidelines for PCB layout:
■
■
inperformance.
■
■
underneath or near it.
■
■
10.3. Matching Network Design
10.3.1. TX PA Matching and Filtering
Bypass capacitors should be placed as close as possible to the pin.
TX matching/layout should mimic reference as much as possible. Failing to do so may cause loss
A solid ground plane is required on the backside of the board under TX matching components
Crystal should be placed as close as possible to the XIN/XOUT pins and should not have VDD traces running
The paddle on the backside of the QFN package needs solid grounding and good soldered connection
Use GND stitch vias liberally throughout the board, especially underneath the paddle.
Frequency
30 MHz
Tel: +86-755-82973805
Figure 43. TX Matching and Filtering for Different Bands
Table 16. Recommended Crystal Parameters
ESR
60Ω
Fax: +86-755-82973550
12PF
C
E-mail: sales@hoperf.com
L
5PF
C
0
R F 4 2 / 4 3
http://www.hoperf.com
Frequency
±20 ppm
51
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