ma4agsbp907 M/A-COM Technology Solutions, Inc., ma4agsbp907 Datasheet

ma4agsbp907

Manufacturer Part Number

ma4agsbp907

Description

Algaas Solder Bump Flip-chip Diode

Manufacturer

M/A-COM Technology Solutions, Inc.

Datasheet

1.MA4AGSBP907.pdf (5 pages)

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Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MA4AGSBP907

Manufacturer:

M/A-COM

Quantity:

5 000

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Meier Automation Equipment Co., Limited

Part Number:

MA4AGSBP907

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MA/COM

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20 000

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Features

♦ Low Series Resistance

♦ Ultra Low Capacitance

♦ Millimeter Wave Switching & Cutoff Frequency

♦ 2 Nanosecond Switching Speed

♦ Can be Driven by a Buffered TTL

♦ Silicon Nitride Passivation

♦ Polyimide Scratch Protection

♦ RoHS Compliant

♦ Solderable Bump Die Attach

Description

M/A-COM's MA4AGSBP907 is an aluminum gallium

arsenide flip-chip PIN diode with solder bumps.

These devices are fabricated on OMCVD epitaxial

wafers using a process designed for high device

uniformity and extremely low parasitics. The diodes

exhibit an extremely low RC product, 0.1ps and 2nS

switching characteristics. The useable frequency

range is 100MHz to 40GHz. They are fully

passivated with silicon nitride and have an additional

layer of a polymer for scratch protection. The

protective coating prevents damage to the junction

and the anode airbridge during handling and circuit

attachment.

Applications

The 25fF capacitance of the MA4AGSBP907 allows

usage through millimeter frequencies for RF switches

and switched phase shifter applications. This diode is

designed for use in pulsed or CW applications,

where single digit nanosecond switching speed is

required. For surface mount assembly, the low

capacitance of the MA4AGSBP907 makes it ideal for

use in microwave multi-throw switch assemblies,

where the series capacitance of each “off” port

adversely loads the input and affects VSWR.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

AlGaAs Solder Bump

Flip-Chip PIN Diode

MA4AGSBP907

RoHS Compliant

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Absolute Maximum Ratings @ T

(unless otherwise specified)

Operating Temperature

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Mounting Temperature

C.W. Incident Power

Junction Temperature

Storage Temperature

Visit www.macomtech.com for additional data sheets and product information.

Dissipated Power

Mounting Side with Solder Bumps

Reverse Voltage

( RF & DC )

Parameter

+280°C for 10 seconds

Absolute Maximum

-55°C to +125°C

-55°C to +150°C

+23 dBm

+175°C

50mW

-50V

AMB

= 25°C

Rev. V4

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ma4agsbp907 Summary of contents

Page 1

... CW applications, where single digit nanosecond switching speed is required. For surface mount assembly, the low capacitance of the MA4AGSBP907 makes it ideal for use in microwave multi-throw switch assemblies, where the series capacitance of each “off” port adversely loads the input and affects VSWR. ...

Page 2

... MA4AGSBP907 AlGaAs Solder Bump Flip-Chip PIN Diode Parameters and Test Conditions Total Capacitance at –10V Series Resistance at +10mA Forward Voltage at +10mA Reverse Breakdown Voltage at 10μA Switching Speed 90% RF Voltage 10% RF Voltage Notes: . Capacitance is determined by measuring single series diode isolation in a 50Ω line at 10GHz. ...

Page 3

... MA4AGSBP907 AlGaAs Solder Bump Flip-Chip PIN Diode Electrical Specifications @ T Single Series Diode Insertion Loss vs. Frequency 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 Single Series Diode Return Loss vs. Frequency -20.0 -22.0 -24.0 -26.0 -28.0 -30.0 -32.0 -34.0 -36.0 -38.0 -40.0 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. ...

Page 4

... MA4AGSBP907 AlGaAs Solder Bump Flip-Chip PIN Diode Electrical Specifications @ T -5.0 -10.0 -15.0 -20.0 -25.0 -30.0 -35.0 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development ...

Page 5

... RoHS Compliant Device Installation Guidelines Ordering Information Part Number Packaging MA4AGSBP907 Die in Carrier • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macomtech.com for additional data sheets and product information. ...

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