isl29003 Intersil Corporation, isl29003 Datasheet - Page 12

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isl29003

Manufacturer Part Number
isl29003
Description
Light-to-digital Output Sensor With High Sensitivity, Gain Selection, Interrupt Function And I2c Interface
Manufacturer
Intersil Corporation
Datasheet

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Suggested PCB Footprint
Footprint pads should be a nominal 1-to-1 correspondence
with package pads. The large, exposed central die-mounting
paddle in the center of the package requires neither thermal
nor electrical connection to the PCB, and such connection
should be avoided.
Layout Considerations
The ISL29003 is relatively insensitive to layout. Like other
I
even in significantly noisy environments. There are only a
few considerations that will ensure best performance.
Route the supply and I
sources of noise. Use two power-supply decoupling
capacitors, 4.7µF and 0.1µF, placed close to the device.
2
C devices, it is intended to provide excellent performance
2.5V - 3.3V
C1
4.7uF
C2
0.1uF
2
REXT
100K
C traces as far as possible from all
1
2
3
12
I2C SLAVE_0
ISL29003
VDD
GND
REXT
SDA
SCL
INT
6
5
4
FIGURE 7. ISL29003 TYPICAL CIRCUIT
R1
10K
I2C SLAVE_1
ISL29003
R2
10K
R3
RES1
SDA
SCL
Typical Circuit
A typical application for the ISL29003 is shown in Figure 7.
The ISL29003’s I
1000100. The device can be tied onto a system’s I
together with other I
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The plastic
ODFN package does not require a custom reflow soldering
profile, and is qualified to +260°C. A standard reflow
soldering profile with a +260°C maximum is recommended.
1.8V - 5.5V
I2C SLAVE_n
2
C address is internally hardwired as
2
C compliant devices.
SDA
SCL
I2C MASTER
MICROCONTROLLER
SDA
SCL
October 8, 2007
2
C bus
FN7464.3

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