s29gl01gp Meet Spansion Inc., s29gl01gp Datasheet - Page 14

• Manufacturer Part Number: s29gl01gp
• Description: 3.0 Volt-only Page Mode Flash Memory Featuring 90 Nm Mirrorbit Process Technology
• Manufacturer: Meet Spansion Inc.

4.3
14
LAA064—64 ball Fortified Ball Grid Array, 11 x 13 mm
PACKAGE
JEDEC
SYMBOL
SD / SE
MD
ME
A1
A2
D1
E1
eD
eE
φb
D
N
A
E
0.40
0.60
0.50
MIN
---
13.00 mm x 11.00 mm
Figure 4.2 LAA064—64ball Fortified Ball Grid Array (FBGA), 11 x 13 mm
13.00 BSC.
11.00 BSC.
PACKAGE
7.00 BSC.
7.00 BSC.
1.00 BSC.
1.00 BSC.
0.50 BSC.
LAA 064
NONE
NOM
0.60
N/A
64
---
---
---
8
8
MAX
1.40
0.70
---
---
PROFILE HEIGHT
STANDOFF
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S29GL-P MirrorBit
NOTE
D a t a
®
Flash Family
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
S h e e t
S29GL-P_00_A11 June 11, 2008
3354 \ 16-038.12d