s29gl01gp Meet Spansion Inc., s29gl01gp Datasheet - Page 16

• Manufacturer Part Number: s29gl01gp
• Description: 3.0 Volt-only Page Mode Flash Memory Featuring 90 Nm Mirrorbit Process Technology
• Manufacturer: Meet Spansion Inc.

4.4
16
PACKAGE
SYMBOL
JEDEC
A1
A2
D1
b1
c1
O
R
N
A
b
D
E
e
L
c
TS056—56-Pin Standard Thin Small Outline Package (TSOP)
19.80
18.30
13.90
MIN.
0.05
0.95
0.17
0.17
0.10
0.10
0.50
0.08
---
0˚
MO-142 (B) EC
0.50 BASIC
TS 56
NOM.
20.00
18.40
14.00
1.00
0.20
0.22
0.60
---
---
---
---
---
56
-
Figure 4.4 56-Pin Thin Small Outline Package (TSOP), 14 x 20 mm
MAX.
20.20
18.50
14.10
1.20
0.15
1.05
0.23
0.27
0.16
0.21
0.70
0.20
8˚
S29GL-P MirrorBit
NOTES:
1
2
3
4
5
6
7
8
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
MOLD PROTUSION IS 0.15 mm PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE
DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b
DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.
THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10 mm AND 0.25 mm FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
D a t a
®
Flash Family
S h e e t
S29GL-P_00_A11 June 11, 2008
3160\38.10A