upc2766gs Renesas Electronics Corporation., upc2766gs Datasheet - Page 14

• Manufacturer Part Number: upc2766gs
• Description: Wide Band Iq Demodulator For Digital Video/data Receiver
• Manufacturer: Renesas Electronics Corporation.

RECOMMENDED SOLDERING CONDITIONS
different conditions.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
14
PC2766GR
Infrared ray reflow
VPS
Wave soldering
Partial heating method
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used or in case soldering is done under
For details of recommended soldering conditions for surface mounting, refer to information document
Note
Caution
Soldering process
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 C and relative humidity at 65 % or less.
Do not apply more than single process at once, except for “Partial heating method”.
Peak package’s surface temperature: 235 C or below,
Reflow time: 30 seconds or below (210 C or higher),
Number of reflow process: 3, Exposure limit
Peak package’s surface temperature: 215 C or below,
Reflow time: 40 seconds or below (200 C or higher),
Number of reflow process: 3, Exposure limit
Solder temperature: 260 C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit
Terminal temperature: 300 C or below,
Flow time: 3 seconds or below,
Exposure limit
Note
: None
Data Sheet P10193EJ4V0DS00
Soldering conditions
Note
Note
Note
: None
: None
: None
WS60-00-1
VP15-00-3
IR35-00-3
PC2766GR/GS
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