upc8172tk Renesas Electronics Corporation., upc8172tk Datasheet - Page 31

• Manufacturer Part Number: upc8172tk
• Description: Small Package Frequency Up-converter Ic
• Manufacturer: Renesas Electronics Corporation.

14. NOTES ON CORRECT USE
15. RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
Infrared Reflow
Wave Soldering
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Connect a bypass capacitor (example : 1 000 pF) to the V
(4) Connect a matching circuit to the RF output pin.
(5) The DC cut capacitor must be attached to input and output pin.
This product should be soldered and mounted under the following recommended conditions.
Soldering Method
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Data Sheet PU10407EJ02V0DS
Soldering Conditions
CC
pin.
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
µ
WS260
HS350
For soldering
IR260
PC8172TK
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