mc100ep446 ON Semiconductor, mc100ep446 Datasheet - Page 19

• Manufacturer Part Number: mc100ep446
• Description: 3.3v/5v 8??bit Cmos/ecl/ttl Data Input Parallel/serial Converter
• Manufacturer: ON Semiconductor

SEATING
PLANE
9
B
−AB−
−AC−
B1
−T−
8
1
32
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
NOTES:
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION:
3. DATUM PLANE −AB− IS LOCATED AT
4. DATUMS −T−, −U−, AND −Z− TO BE
5. DIMENSIONS S AND V TO BE
6. DIMENSIONS A AND B DO NOT
7. DIMENSION D DOES NOT INCLUDE
8. MINIMUM SOLDER PLATE THICKNESS
9. EXACT SHAPE OF EACH CORNER
PER ANSI Y14.5M, 1982.
MILLIMETER.
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DETERMINED AT DATUM PLANE −AB−.
DETERMINED AT SEATING PLANE −AC−.
INCLUDE MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.250
(0.010) PER SIDE. DIMENSIONS A AND
B DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE
−AB−.
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
SHALL BE 0.0076 (0.0003).
MAY VARY FROM DEPICTION.
−Z−
25
4X
17
4X
0.20 (0.008)
−U−
0.20 (0.008)
V1
PACKAGE DIMENSIONS
DETAIL AD
V
http://onsemi.com
AB
32 LEAD LQFP
CASE 873A−02
AC
T−U
ISSUE C
T−U
19
Z
C
Z
E
P
H
DIM
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
V
X
F
J
8X
1.400
0.300
1.350
0.300
0.050
0.090
0.450
0.090
0.150
MILLIMETERS
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
12 REF
1
M_
_
_
W
DETAIL AD
1.600
0.450
1.450
0.400
0.150
0.200
0.750
0.160
0.250
MAX
5
DETAIL Y
_
0.055
0.012
0.053
0.012
0.002
0.004
0.018
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
1
12 REF
INCHES
_
_
MAX
0.063
0.018
0.057
0.016
0.006
0.008
0.030
0.006
0.010
X
5
_
AE
AE
K
R
Q_
SECTION AE−AE
É É É É
F
É É
METAL
BASE
N
J
D