lmk02002 National Semiconductor Corporation, lmk02002 Datasheet - Page 15

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lmk02002

Manufacturer Part Number
lmk02002
Description
Precision Clock Conditioner With Integrated Pll
Manufacturer
National Semiconductor Corporation
Datasheet
To minimize junction temperature it is recommended that a
simple heat sink be built into the PCB (if the ground plane
layer is not exposed). This is done by including a copper area
of about 2 square inches on the opposite side of the PCB from
the device. This copper area may be plated or solder coated
to prevent corrosion but should not have conformal coating (if
FIGURE 2.
15
possible), which could provide thermal insulation. The vias
shown in Figure 2 should connect these top and bottom cop-
per layers and to the ground layer. These vias act as “heat
pipes” to carry the thermal energy away from the device side
of the board to where it can be more effectively dissipated.
30023373
www.national.com

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