74lvc1g07gf NXP Semiconductors, 74lvc1g07gf Datasheet
74lvc1g07gf
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74lvc1g07gf Summary of contents
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Inverter with open-drain output Rev. 07 — 12 July 2007 1. General description The 74LVC1G06 provides the inverting buffer. Input can be driven from either 3 devices. These features allow the use of these devices ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range 74LVC1G06GW +125 C 74LVC1G06GV +125 C 74LVC1G06GM +125 C 74LVC1G06GF +125 C 4. Marking Table 2. Marking codes Type number 74LVC1G06GW 74LVC1G06GV 74LVC1G06GM 74LVC1G06GF 5. Functional diagram mna618 Fig 1. Logic symbol ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning 74LVC1G06 n. GND 001aaf192 Fig 4. Pin configuration SOT353-1 and SOT753 6.2 Pin description Table 3. Pin description Symbol Pin SOT353-1/SOT753 n. GND n. Functional description [1] Table 4. Function table Input [ HIGH voltage level ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC I input diode current IK V input voltage I I output diode current OK V output voltage O I output source or sink current O I supply current ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V HIGH-level output voltage LOW-level output voltage ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for load circuit see Symbol Parameter Conditions t propagation delay see pd C power dissipation capacitance [1] Typical values are measured the same as t and PLZ ...
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... NXP Semiconductors Table 9. Measurement points Supply voltage Input 1. 1.95 V 0.5V 2 2.7 V 0.5V 2.7 V 1 3.6 V 1 5.5 V 0.5V Test data is given in Table 10. Definitions test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 10. Package outline SOT753 (SC-74A) 74LVC1G06_7 Product data sheet scale ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 1.5 mm 0.5 0.04 0.17 1.4 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 12. Package outline SOT891 (XSON6) ...
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... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 10 “Static Changed: Conditions for input leakage current and supply current. ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 Abbreviations ...