mc68hc908ap8a Freescale Semiconductor, Inc, mc68hc908ap8a Datasheet - Page 310

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mc68hc908ap8a

Manufacturer Part Number
mc68hc908ap8a
Description
M68hc08 Microcontrollers
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Mechanical Specifications
23.2 48-Pin Low-Profile Quad Flat Pack (LQFP)
310
B
B1
9
AB
AC
T
12
1
4X
SECTION AE–AE
0.080
4X
0.200 AC T–U
48
13
S1
0.200 AB T–U
BASE METAL
M
A1
F
D
AC
G
A
S
T–U
N
Z
Z
Z
Z
J
37
24
AD
Figure 23-1. 48-Pin LQFP (Case #932)
MC68HC908AP A-Family Data Sheet, Rev. 3
36
25
U
V1
0.080 AC
DETAIL Y
V
C
H
E
DETAIL AD
TOP & BOTTOM
DETAIL Y
M °
AE
W
P
T, U, Z
AE
AA
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM OF
4. DATUMS T, U, AND Z TO BE DETERMINED AT
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
R
Y14.5M, 1994.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
DATUM PLANE AB.
SEATING PLANE AC.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
0.0076.
DIM
AA
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
R
S
V
F
J
L
MILLIMETERS
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0.150
L °
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.500 BSC
0.250 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
12° REF
Freescale Semiconductor
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
0.250
MAX

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