mpc8349ea Freescale Semiconductor, Inc, mpc8349ea Datasheet - Page 73

• Manufacturer Part Number: mpc8349ea
• Description: Mpc8349ea Powerquicc
• Manufacturer: Freescale Semiconductor, Inc

1
2
20 Thermal
This section describes the thermal specifications of the MPC8349EA.
20.1
Table 62
Freescale Semiconductor
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (@ 200 ft/min) on single-layer board (1s)
Junction-to-ambient (@ 200 ft/min) on four-layer board (2s2p)
Junction-to-ambient (@ 2 m/s) on single-layer board (1s)
Junction-to-ambient (@ 2 m/s) on four-layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
No.
306
405
504
Ref
The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and
COREPLL settings given in the table.
The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode.
1
SPMF
0011
0100
0101
provides the package thermal characteristics for the 672 35 × 35 mm TBGA of the MPC8349EA.
Thermal Characteristics
MPC8349EA PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10
RCWL
0000110
0000101
0000100
CORE
PLL
Characteristic
(MHz)
Clock
Input
Freq
Table 61. Suggested PLL Configurations (continued)
Table 62. Package Thermal Characteristics for TBGA
400 MHz Device
2
(MHz)
CSB
Freq
—
—
—
(MHz)
Core
Freq
(MHz)
Clock
Input
Freq
533 MHz Device
2
(MHz)
Freq
CSB
—
—
—
Symbol
R
R
R
R
R
R
R
R
θJMA
θJMA
θJMA
θJMA
θJMA
θJC
θJA
θJB
(MHz)
Core
Freq
Value
(MHz)
3.8
1.7
Clock
14
11
11
Input
Freq
8
9
7
66
66
66
667 MHz Device
2
(MHz)
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
CSB
Freq
Unit
200
266
333
Notes
(MHz)
Core
Thermal
Freq
600
667
667
1, 2
1, 3
1, 3
1, 3
1, 3
1, 3
4
5
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