mpc8314e Freescale Semiconductor, Inc, mpc8314e Datasheet - Page 100

• Manufacturer Part Number: mpc8314e
• Description: Powerquicc Ii Pro Processor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

Thermal (Preliminary)
Interface material vendors include the following:
24.3
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
100
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105
Internet: www.tycoelectronics.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
Corporate Center
PO BOX 994
Midland, MI 48686-0994
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Heat Sink Attachment
MPC8314E PowerQUICC
™
II Pro Processor Hardware Specifications, Rev. 0
408-436-8770
800-522-6752
603-635-2800
781-935-4850
800-248-2481
888-642-7674
800-347-4572
Freescale Semiconductor