mpc5644a Freescale Semiconductor, Inc, mpc5644a Datasheet - Page 75

• Manufacturer Part Number: mpc5644a
• Description: Mpc5644a Microcontroller Data Sheet
• Manufacturer: Freescale Semiconductor, Inc

Freescale Semiconductor
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R
Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
R
R
R
R
R
R
R
R
R
R
R
JCtop


JMA
JMA
JMA
JMA
JA
JA
JB
JC
JA
JA
JB
Symbol
Symbol
JT
JT
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
C
D Junction-to-Ambient, Natural Convection
D Junction-to-Ambient, Natural Convection
D Junction-to-Moving-Air, Ambient
D Junction-to-Moving-Air, Ambient
D Junction-to-board
D Junction-to-case
D Junction-to-package top natural convection
C
D Junction-to-Ambient, Natural Convection
D Junction-to-Ambient, Natural Convection
D Junction-to-Moving-Air, Ambient
D Junction-to-Moving-Air, Ambient
D Junction-to-Board
D Junction-to-Case
D Junction-to-Package Top, Natural
Convection
Table 10. Thermal characteristics for 208-pin MAPBGA
Table 11. Thermal characteristics for 324-pin TEPBGA
Preliminary—Subject to Change Without Notice
MPC5644A Microcontroller Data Sheet, Rev. 4
5
Parameter
Parameter
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4
5
3
2,4
2,4
2
2
2,3
2,4
2
2
7
One layer board - 1s
Four layer board - 2s2p
@200 ft./min., one layer
board
@200 ft./min., four layer
board 2s2p
Four layer board - 2s2p
Single layer board - 1s
Four layer board - 2s2p
@200 ft./min., single layer
board
@200 ft./min., four layer
board 2s2p
Conditions
Conditions
1
1
Electrical characteristics
Value
Value
39
24
31
20
13
29
19
23
16
10
6
2
7
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
75