mpc5534mzq66 Freescale Semiconductor, Inc, mpc5534mzq66 Datasheet - Page 8

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mpc5534mzq66

Manufacturer Part Number
mpc5534mzq66
Description
Mpc5534 High Performance Microcontroller
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Electrical Characteristics
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
References:
Semiconductor Equipment and Materials International
805 East Middlefield Rd
Mountain View, CA 94043
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
3.3
The MPC5534 is available in packaged form. Package options are listed in
Information.”
Refer to
3.4
8
Num
1
2
3
Scan Range
Operating Frequency
V
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled
Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal
Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego,
1999, pp. 212–220.
DD
Section 4, “Mechanicals,”
Package
EMI (Electromagnetic Interference) Characteristics
Operating Voltages
where:
T
Ψ
P
D
T
JT
= thermocouple temperature on top of the package (
= power dissipation in the package (W)
= thermal characterization parameter (
Characteristic
Preliminary—Subject to Change Without Notice
MPC5534 Microcontroller Data Sheet, Rev. 0
Table 4. EMI Testing Specifications
for pinouts and package drawings.
o
Min. Value
C/W)
0.15
1
o
C)
Typ. Value
1.5
Section 2, “Ordering
Freescale Semiconductor
Max. Value
1000
80
MHz
MHz
Unit
V

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