tspc603r ATMEL Corporation, tspc603r Datasheet - Page 47

• Manufacturer Part Number: tspc603r
• Description: Powerpc 603e Risc Microprocessor Family Pid7t-603e
• Manufacturer: ATMEL Corporation

15. Package Mechanical Data
15.1
5410B–HIREL–09/05
HiTCE CBGA Package Parameters
The following sections provide the package parameters and mechanical dimensions for the
CBGA, HiTCE CBGA and the Cerquad packages.
The package parameters are as provided in the following list. The package type is 21 mm, 255-
lead HiTCE Ceramic Ball Array (HiTCE CBGA).
Package outline
Interconnects
Pitch
Maximum module height
255
1.27 mm
21 mm × 21 mm
3.08 mm
TSPC603R
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