hsdl-3007 ETC-unknow, hsdl-3007 Datasheet

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hsdl-3007

Manufacturer Part Number
hsdl-3007
Description
Irda Data Compliant Low Power 115.2kbit/s With Remote Control Infrared Transceiver
Manufacturer
ETC-unknow
Datasheet
Description
The HSDL-3007 is a new
generation ultra-low profile
enhanced infrared (IR)
transceiver module that
provides the capability of (1)
interface between logic and IR
signals for through-air, serial,
half-duplex IR data link, and
(2) IR remote control
transmission for universal
remote control applications.
The HSDL-3007 can be used
for IrDA as well as remote
control application without the
need of any additional external
components for multiplexing.
The HSDL-3007 is fully
compliant to IrDA
Layer specification version 1.4
low power from 9.6 kbit/s to
115.2 kbit/s (SIR) and IEC825
Class 1 eye safety standards.
This preliminary data is provided to assist you in the evaluation of product(s) currently under development. Until Agilent
Technologies releases this product for general sales, Agilent Technologies reserves the right to alter prices,
specifications, features, capabilities, functions, release dates, and remove availability of the product(s) at anytime.
Physical
Agilent HSDL-3007 IrDA
Compliant Low Power 115.2 Kbit/s
with Remote Control Infrared
Transceiver
Preliminary Data Sheet
IrDA
• • • • • Fully Compliant to IrDA 1.4
• • • • • Link distance up to 50cm typically
• • • • • Complete shutdown for TxD_IrDA,
• • • • • Low Power Consumption
• • • • • Low shutdown current
Remote Control Features
• • • • • Wide angle and high radiant
• • • • • Spectrally suited to remote
• • • • • Typical link distance up to 7 meter
Applications
• • • • • Mobile data communication and
Physical Layer Low Power
Specifications from 9.6 kbit/s to
115.2 kbit/s
RxD_IrDA and PIN diode
intensity
control transmission function
universal remote control
    
Features
Mobile Phones
PDAs
Webpads
Features
General Features
• • • • • Guaranteed temperature
• • • • • Vcc Supply 2.4 to 3.6 Volts
• • • • • Miniature Package
• • • • • Integrated remote control LED
• • • • • Input/Output Interface Voltage of
• • • • • Excellent EMI performance
• • • • • LED Stuck-High Protection
• • • • • Designed to Accommodate Light
• • • • • IEC 825-Class 1 Eye Safe
• • • • • LED stuck high protection
• • • • • Interface to Various Super I/O
• • • • • Lead Free package
performance
Critical parameters are guaranteed
over temperature and supply
voltage
- Height : 1.60 mm
- Width : 7.00 mm
- Depth : 2.80 mm
driver
1.8 V
without shield
Loss with Cosmetic Windows
and Controller Devices
    
Data

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hsdl-3007 Summary of contents

Page 1

... Description The HSDL-3007 is a new generation ultra-low profile enhanced infrared (IR) transceiver module that provides the capability of (1) interface between logic and IR signals for through-air, serial, half-duplex IR data link, and (2) IR remote control transmission for universal remote control applications. The HSDL-3007 can be used ...

Page 2

... Current Source SD(2) CX4 RXD_IrDA(4) VLED R1 TRANSMITTER CX3 LEDA (1) TXD_RC Eye TxD_RC(6) Input Safety-RC TXD_IR TxD_IrDA(3) Input Safety-IR TRANSMIT TER Figure 1. Functional Block Diagram of HSDL-3007 I/O Pins Configuration Table Pin Symbol 1 LEDA TxD_IR 4 RxD 7 Vcc 6 TxD_RC 7 IOVcc 8 GND Notes IrDA mode contant current source mode, the current can be controlled by external resistor, R1, which is tied to Vled. Refer to the table below for recommended series resistor value ...

Page 3

... ESD Recommended Application Circuit Components Component Recommended Value R1 1 ohm ± 5%, 0.0625W for 2.4V CX1, CX4 100 nF, ± 20%, X7R Ceramic CX2,CX3 Notes: 1. CX1, CX2 must be placed within 0.7cm of HSDL-3007 to obtain optimum noise immunity Transceiver I/O Truth Table SD TXD_IrDA TXD_RC ...

Page 4

Recommended Operating Conditions Parameter Operating Temperature Supply Voltage Input/Output Voltage LED Anode Voltage Logic Input Voltage Logic High for TXD IR Logic Low Logic Inout Voltage Logic High for TXD RC Logic Low Logic Inout Voltage Logic High for SD ...

Page 5

Electrical and Optical Specifications - Transmitter Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C, Vcc set to ...

Page 6

... ILED(mA) vs LOP (mW/Sr) (HSDL-3007) 100 100 200 300 ILED (mA) ILed Vs Lop graph TXD "Stuck ON" Protection TXD LED t pw (MAX.) RXD Output Waveform 90% 50% 10 Receiver wakeup time waveform LIGHT RXD MODE 0.045 ...

Page 7

... HSDL-3007 Package Dimensions 2.80 3.50 MOUNTING CENTER 7.00 ± 0.10 0.80 0.95 5.10 0.95 R 1.10 R 1.10 0.35 2.80 LED A LED C TXD RXD GND 0.85 (7X) 0.55 (8X) Notes : 1. All dimension in millimeters (mm) 2. Dimension tolerance is 0.2 mm unless otherwise specified 7 0.80 1.60 ± 0.10 1.60 0.80 1) Pin 1 : LEDA 2) Pin Pin 3 : TXD IR 4) Pin 4 : RXD 0.40 (8X) 5) Pin 5 : VDD 6) Pin 6 : TXD RC 7) Pin 7 : IOVCC ...

Page 8

... HSDL-3007 Tape and Reel Dimensions 4.0 ± 0.1 UNIT 0.1 1.5 0 POLARITY PIN 7: GND 7.35 ± 0.1 PIN 1: LED A 2.93 ± 0.1 0.3 ± 0.05 1.78 ± 0.1 PROGRESSIVE DIRECTION EMPTY PARTS MOUNTED (40 mm MIN.) DETAIL A LABEL 8 1.75 ± 0.1 2.0 ± 0.1 7.5 ± 0.1 16.0 ± 0.2 4.0 ± 0.1 LEADER (400 mm MIN.) EMPTY (40 mm MIN.) OPTION # "B" "C" ...

Page 9

... HSDL-3007 Moisture Proof Packaging All HSDL-3007 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. Yes No Baking Is Necessary Figure 4. Baking Conditions Chart Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts ...

Page 10

... The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and HSDL-3007 castellations to change dimensions evenly, putting minimal stresses on the HSDL- 3007 transceiver. 300 ...

Page 11

... Appendix A: HSDL-3007 SMT Assembly Application Note Recommended Metal solder Stencil Aperture It is recommended that only a 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. See the Table 1 below the drawing for combinations of ...

Page 12

... Appendix B: PCB Layout Suggestion The HSDL-3007 is a shieldless part and hence does not contain a shield trace unlike the other transceivers. The effects of EMI and power supply noise can potentially reduce the sensitivity of the receiver, resulting in reduced link distance. The following PCB layout guidelines should ...

Page 13

... Appendix C: General Application Guide for the HSDL-3007 Infrared IrDA Description The HSDL-3007, a wide- voltage operating range infrared transceiver low- cost and ultra small form factor device that is designed to address the mobile computing market such as PDAs, as well as small embedded mobile products such as digital cameras and cellular phones ...

Page 14

... Assuming the thickness of the window to be negligible, the equations result in the following table and figures: OPAQUE MATERIAL IR Transparent Window Y IR Transparent Window Figure 7. Window Design for HSDL-3007 Module Depth (z) mm Aperture Width (x, mm) Aperture height (y, mm) Max 0 8.76 1 9.92 2 11.07 3 12.22 4 13. ...

Page 15

Window Material Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture filter dye may be used in the window to make it ...

Page 16

... Order Information Part Number HSDL-3007-021 Packaging Type Tape and Reel Package Front Option Quantity 2500 www.agilent.com/ semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 ...

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