hsdl-3202 ETC-unknow, hsdl-3202 Datasheet
hsdl-3202
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hsdl-3202 Summary of contents
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... Description The HSDL-3202 is a new generation of low-cost Infrared (IR) transceiver modules from Agilent Technologies. It features one of the smallest foot- prints in the industry 3.0 D mm. Although the supply voltage can range from 2 3.6 V, the LED drive current is internally compensated to a con- stant guarantee link dis- ...
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Application Circuit 8 VLED C1 7 TXD 1.0 µF TXD 6 RXD RXD 5 SD SHUT DOWN 4 AGND 1.0 µF I GND 1.0 µF I/O Pins Configuration Table Pin Symbol Description ...
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... No signal High Don’t care High 5 Shutdown Mode Notes When the HSDL-3202 is in Shut- down Mode (SD pin high), the part presents different imped- ances to the rest of the circuit than when normal mode. RXD Pin: This pin is NOT Tri- state. During shutdown the ...
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Recommended Operating Conditions Parameter Symbol Operating Temperature T A Supply Voltage V CC Input/Output Voltage IOV LED Supply Voltage V LED TXD, SD Input Logic High V IH Voltage Logic Low V IL Receiver Input Logic High EI H Irradiance ...
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Electrical & Optical Specifications Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values are and 3.0 V unless otherwise noted. Parameter Symbol Min. ...
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... CC IOV CC Notes: 1. C1,C2, and C3 must be placed within 0 the HSDL-3202 to obtain optimum noise immunity application may use one less capacitor TXD is stuck in the high state, the LED will turn off after about In-Band IrDA signals and data rates 115.2 Kb/s. ...
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Package Dimensions 2.05 1.175 2.85 3.0 1.85 0.6 7 MOUNTING 4.0 CENTER 1.025 C L RECEIVER EMITTER 2.2 1.05 1.25 2.55 4.0 8.0 2 UNIT: mm TOLERANCE: ± 0.2 mm PIN 1 3.325 6.65 2.5 0.35 0.65 0.80 ...
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Moisture Proof Packaging The HDSL-3202 is shipped in moisture proof packaging. Once opened, moisture absorption begins. Recommended Storage Conditions Storage Temperature Relative below 60% RH Humidity Time from Unsealing to Soldering After removal from the ...
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Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inch 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no ...
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PCB Layout Suggestion The following PCB layout shows a recommended layout that should result in good electrical and EMI performance. Things to note: 1. The ground plane should be continuous under the part, but should not extend under the shield ...
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... Pick and Place Misalignment Tolerance and Self-Alignment after Solder Reflow If the printed solder paste volume is adequate, the HSDL-3202 will self-align after solder reflow. Units should be properly reflowed in IR/hot air convection oven using the recommended reflow profile. The direction of board travel does not matter. ...
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... The cool down rate, R5, from the liquidus point of the solder (77 F) should not exceed –3 C per second maximum. This limitation is necessary to allow the PC board and HSDL-3202 castellation I/O pins to change dimensions evenly, putting mini- mal stresses on the HSDL-3202 transceiver. ...
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... the width of the window the height of the window, and Z is the distance from the HSDL-3202 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens is 5.1 mm. The equations for the size of the window are as follows ...
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Shape of the Window From an optics standpoint, the window should be flat. This en- sures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must ...
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Test Methods Background Light and Electromagnetic Field There are four ambient interfer- ence conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic Field: 3 V/m maximum (please refer to IEC 801-3, ...
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Data subject to change. Copyright © 2001 Agilent Technologies, Inc. March 21, 2001 Obsoletes 5980-1500E (5/00) 5988-2313EN ...