hsdl-3003 ETC-unknow, hsdl-3003 Datasheet
hsdl-3003
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hsdl-3003 Summary of contents
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... Description The HSDL-3003 is a small form factor enhanced infrared (IR) transceiver module that provides the capability of (1) interface between logic and IR signals for through-air, serial, half-duplex IR data link, and (2) IR remote control transmission operating at the optimum 940 nm wavelength for universal remote control applications ...
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... Layer Specification Version 1.4 Low Power from 9.6 kbit/s to 115.2 kbit/s (SIR) and it is IEC 825-Class 1 Eye Safe. The HSDL-3003 has very low idle current and can be shutdown completely to achieve very low power consumption. In the Order Information Part Number Packaging Type HSDL-3003-021 Tape and Reel Marking Information The unit is marked with ‘ ...
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... CX2 6.8 F 20%, Tantalum CX3 6.8 F 20%, Tantalum Notes: 1. CX1 must be placed within 0 HSDL-3003 to obtain optimum noise immunity. 2. The supply rejection performance can be enhanced by including CX2, as shown in Figure 1, in environment with noisy power supplies. 3 Notes Tied through external resistor, R1, to VLED from 2.4 to 4.5 Volt No Connection Logic high turns on the IrDA LED ...
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... Different Remote Control Configurations for HSDL-3003 The HSDL-3003 can operate in the single-TXD programmable mode or the two-TXD direct transmission mode. Single-TXD Programmable Mode In the single-TXD programmable mode, only one input pin (TxD_IrDA input pin) is used SHUTDOWN (ACTIVE HIGH) TxD_IrDA • • • ...
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Absolute Maximum Ratings For implementations where case to ambient thermal resistance is 50 C/W Parameter Storage Temperature Operating Temperature LED Supply Voltage Supply Voltage Output Voltage: RxD Total LED Current Pulse Amplitude IR LED ...
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Electrical and Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are with V 3.0 V ...
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Transceiver Parameters Input Current High Low Supply Current Shutdown Idle (Standby) Active Notes in-band optical signal is a pulse/sequence where the peak wavelength, are compliant with the IrDA Serial Infrared Physical Layer Link Specification version 1.4. 4. For ...
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V OH 90% 50% 10 Figure 7. RXD output waveform. LED ON 90% 50% 10% LED OFF t r Figure 8. LED optical waveform. TXD LED t pw (MAX.) Figure 9. TXD “Stuck ON” protection. SD ...
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... HSDL-3003 Package Outline (With Integrated EMI Shield) 1.025 2.70 1.20 EMITTER 0.95 2.90 1 0.425 Figure 12. Package outline drawing. 9 4.00 MOUNTING CENTER 8.00 1.425 2.70 2.10 5.10 1.20 RECEIVER R 1.03 R 1.10 2. 0.60 PITCH 0.95 0.50 1 VLEDA TXD IRDA 7 TXD RC 4 RXD 8 GND 0.80 0.70 COPLANARITY: +0.05 TO -0.15 mm NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (mm). ...
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... HSDL-3003 Tape and Reel Dimensions 5.00° (MAX.) POLARITY PIN 8: GND SECTION B-B 8.30 ± 0.10 PIN 1: VLED 0.40 ± 0.10 3.00 ± 0.10 LABEL Figure 13. Tape and reel dimensions. 10 4.0 ± 0.1 2.0 ± 0.1 1.55 ± 0. 8.00 ± 0.10 5°(MAX.) 3.25 ± 0.10 SECTION A-A PROGRESSIVE DIRECTION EMPTY PARTS MOUNTED (40 mm MIN.) (40 mm MIN.) EMPTY (40 mm MIN ...
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... Moisture Proof Packaging All HSDL-3003 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 25°C, AND LESS THAN 60% RH? NO PACKAGE IS OPENED MORE THAN 72 HOURS? ...
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... I/O pins are heated to a temperature of 160 C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited per second to allow for even heating of both the PC board and HSDL-3003 I/O pins. 12 MAX. 260° sec. MAX. ABOVE 220° ...
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Appendix A: SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil STENCIL APERTURE SOLDER MASK Figure 16. Stencil and PCBA. 1.1 Recommended Land Pattern MOUNTING CENTER 0.10 1.75 0.60 0.475 Figure 17. Land pattern. 13 METAL STENCIL FOR ...
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Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inch 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and ...
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Appendix B: PCB Layout Suggestion The following PCB layout guidelines should be followed to obtain a good PSRR and EM immunity resulting in good electrical performance. Things to note: 1. The ground plane should be continuous under the part, but ...
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... Appendix C: General Application Guide for the HSDL-3003 Infrared ® IrDA Compliant 115.2 Kb/s Transceiver Description The HSDL-3003, a wide-voltage operating range infrared transceiver is a low-cost and small form factor device that is designed to address the mobile computing market such as PDAs, as well as small embedded mobile products such as digital cameras and cellular phones ...
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... CONTROLLER RS232C DRIVER PDA PLATFORM Figure 2. IR layout in PDA platform. The link distance testing was done using typical HSDL-3003 units with SMC’s FDC37C669 and FDC37N769 Super I/O controllers. An IrDA link distance was demonstrated. Remote Control Operation The HSDL-3003 is spectrally ...
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... IrDA cone angles are met OPAQUE MATERIAL IR TRANSPARENT WINDOW Y IR TRANSPARENT WINDOW Z In the figure above the width of the window the height of the window, and Z is the distance from the HSDL-3003 to the back Module Depth Min Aperture Width (Z, mm) (X, mm) 0.5 11.45 1.0 11.75 1 ...
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Aperture width (X) vs. module depth MIN MODULE DEPTH (Z) – mm For module depth values that are not shown on the table ...
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Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be ...
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For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 ...