hsdl-3202 ETC-unknow, hsdl-3202 Datasheet - Page 9

• Manufacturer Part Number: hsdl-3202
• Description: Irda Data Power Compliant 115.2 Kb/s Infrared Transceiver
• Manufacturer: ETC-unknow

Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inch) or a
0.127 mm (0.005 inch) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See the
table below the drawing for
combinations of metal stencil
aperture and metal stencil thick-
ness that should be used.
Aperture opening for shield pad
is 2.7 mm x 1.25 mm as per land
pattern.
Adjacent Land Keepout and Solder
Mask Areas
Adjacent land keepout is the
maximum space occupied by the
unit relative to the land pattern.
There should be no other SMD
components within this area.
0.2 mm is the minimum solder
resist strip width required to
avoid solder bridging adjacent
pads.
It is recommended that two
fiducial crosses be placed at mid-
length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
9
Stencil Thickness, t (mm)
0.152 mm
0.127 mm
l
APERTURES AS PER
LAND DIMENSIONS
0.2
SOLDER MASK
8.2
Length, l
2.60
3.00
Aperture Size (mm)
0.05
0.05
UNITS: mm
w
Width, w
0.55
0.55
2.6
3.0
0.05
0.05
t