hc9p5502b1-5 Intersil Corporation, hc9p5502b1-5 Datasheet - Page 12

• Manufacturer Part Number: hc9p5502b1-5
• Description: Slic Subscriber Line Interface Circuit
• Manufacturer: Intersil Corporation

Small Outline Plastic Packages (SOIC)
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: [phone]
FAX: [phone]
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
xxx
xxx
xxx
xxx
xxx
xxx
xxx
xxx
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
are not necessarily exact.
xx
xx
2
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
-A-
INDEX
AREA
3
e
B
D
M
C A
For information regarding Intersil Corporation and its products, see web site www.intersil.com
xxxxxxx
SEATING PLANE
M
x
x x
E
-C-
-B-
B S
4-12
A
H
A1
0.10(0.004)
0.25(0.010)
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: [phone]
FAX: [phone]
M
L
h x 45
B
M
o
HC-5502B1
C
M24.3
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
C
D
H
N
A
B
E
e
h
L
(JEDEC MS-013-AD ISSUE C)
0.0926
0.0040
0.013
0.0091
0.5985
0.2914
0.394
0.010
0.016
MIN
0
o
0.05 BSC
ASIA
Intersil Ltd.
8F-2, 96, Sec. 1, Chien-kuo North,
Taipei, Taiwan 104
Republic of China
TEL: [phone]
FAX: [phone]
INCHES
24
0.1043
0.0118
0.020
0.0125
0.6141
0.2992
0.419
0.029
0.050
MAX
8
o
15.20
10.00
MILLIMETERS
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MIN
0
o
1.27 BSC
24
15.60
10.65
MAX
2.65
0.30
0.51
0.32
7.60
0.75
1.27
8
o
Rev. 0 12/93
NOTES
9
3
4
5
6
7
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