lmv358iyd STMicroelectronics, lmv358iyd Datasheet - Page 8

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lmv358iyd

Manufacturer Part Number
lmv358iyd
Description
Low Cost Low Power Input/output Rail-to-rail Operational Amplifiers
Manufacturer
STMicroelectronics
Datasheet

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Manufacturer
Quantity
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Manufacturer:
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Package information
3
3.1
8/14
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
SOT23-5 package information
Figure 13. SOT23-5 package mechanical drawing
Table 5.
Ref.
A1
A2
E1
e1
A
C
D
E
b
e
L
®
packages. These packages have a lead-free second level interconnect. The
SOT23-5 package mechanical data
Min.
0.90
0.00
0.90
0.35
0.09
2.80
2.60
1.50
0.35
Millimeters
Typ.
0.95
1.9
Max.
1.45
0.15
1.30
0.50
0.20
3.00
3.00
1.75
0.55
Dimensions
110.2
102.3
Min.
35.4
0.00
35.4
13.7
59.0
13.7
3.5
LMV321-LMV358-LMV324
Typ.
Mils
37.4
74.8
118.1
118.1
Max.
57.1
51.2
19.7
68.8
21.6
5.9
7.8

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