w25x16bv Winbond Electronics Corp America, w25x16bv Datasheet - Page 40

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w25x16bv

Manufacturer Part Number
w25x16bv
Description
16m-bit Serial Flash Memory With 4kb Sectors And Dual Output Spi
Manufacturer
Winbond Electronics Corp America
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
w25x16bvSFIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
Part Number:
w25x16bvSSIG
Manufacturer:
OKISEMICONDUCTOR
Quantity:
3 551
13.2 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
package.
SYMBOL
E1 (3)
D (3)
e (2)
A1
A2
A
C
E
b
L

y
MIN
1.75
0.05
1.70
0.35
0.19
5.18
7.70
5.18
0.50
MILLIMETERS
0 o
---
1.27 BSC
MAX
2.16
0.25
1.91
0.48
0.25
5.38
8.10
5.38
0.80
0.10
- 40 -
8 o
0.069
0.002
0.067
0.014
0.007
0.204
0.303
0.204
0.020
MIN
0 o
---
0.050 BSC
INCHES
0.085
0.010
0.075
0.019
0.010
0.212
0.319
0.212
0.031
0.004
MAX
8 o
W25X16BV

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