w25x32a Winbond Electronics Corp America, w25x32a Datasheet - Page 39

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w25x32a

Manufacturer Part Number
w25x32a
Description
32m-bit Serial Flash Memory With 4kb Sectors And Dual Output Spi
Manufacturer
Winbond Electronics Corp America
Datasheet

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13
13.1 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
PACKAGE SPECIFICATION
SYMBOL
A1
A2
E1
A
C
D
E
b
e
L
θ
y
1.75
0.05
1.70
0.35
0.19
5.18
7.70
5.18
0.50
MIN
MILLIMETERS
---
0
o
1.27 BSC
- 39 -
MAX
2.16
0.25
1.91
0.48
0.25
5.38
8.10
5.38
0.80
0.10
8
o
0.069
0.002
0.067
0.014
0.007
0.204
0.303
0.204
0.020
MIN
---
0
0.050 BSC
o
INCHES
Publication Release Date: August 24, 2008
0.085
0.010
0.075
0.019
0.010
0.212
0.319
0.212
0.031
0.004
MAX
8
o
Preliminary - Revision A
W25X32A

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