w25q64dw Winbond Electronics Corp America, w25q64dw Datasheet - Page 55

no-image

w25q64dw

Manufacturer Part Number
w25q64dw
Description
1.8v 64m-bit Serial Flash Memory With Dual/quad Spi & Qpi
Manufacturer
Winbond Electronics Corp America
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
w25q64dwIG
Quantity:
64
Part Number:
w25q64dwSSIG
Manufacturer:
WINBOND
Quantity:
6 580
Part Number:
w25q64dwSTIM
Manufacturer:
WINBOND
Quantity:
9 410
Part Number:
w25q64dwSTIM
Manufacturer:
WINBON
Quantity:
20 000
Part Number:
w25q64dwZPI
Manufacturer:
WINBOND
Quantity:
6 581
10.2.30 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 29. The Device ID values for the W25Q64DW is listed in Manufacturer and Device Identification
table. The instruction is completed by driving /CS high.
(IO
(IO
(IO
(IO
CLK
CLK
/CS
/CS
DO
DO
DI
DI
0
1
0
1
)
)
)
)
Mode 3
Mode 0
0
31
*
= MSB
32
33
Figure 29. Read Manufacturer / Device ID Instruction (SPI Mode)
Manufacturer ID (EFh)
0
34
1
35
Instruction (90h)
2
36
3
37
4
High Impedance
38
5
- 55 -
39
6
*
7
40
7
6
23
41
*
8
5
22
42
9
Publication Release Date: January 13, 2011
Device ID
Address (000000h)
4
21
43
10
3
44
2
45
3
28
1
46
2
29
Preliminary - Revision C
W25Q64DW
0
1
30
0
Mode 3
Mode 0
31

Related parts for w25q64dw