vnq810p-e STMicroelectronics, vnq810p-e Datasheet
vnq810p-e
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vnq810p-e Summary of contents
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... V OUT CC (1) 3.5A 36V Description The VNQ810P quad HSD formed by assembling two VND810P-E chips in the same SO-28 package. The VNQ810P monolithic device made by using STMicroelectronics VIPower™ M0-3 technology, intended for driving any kind of load with one side connected to ground. Active V device against low energy spikes (see ISO7637 transient compatibility table) ...
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... Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.1 SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.1 ECOPACK 5.2 SO-28 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.3 SO-28 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2/28 Solution 1: a resistor in the ground line (RGND only Solution 2: a diode ( the ground line . . . . . . . . . . . . . . . . . . . . 18 GND ® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Doc ID 17387 Rev 1 = 13.5V VNQ810P-E ...
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... VNQ810P-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 4. Thermal data (per island Table 5. Power output Table output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 CC Table 8. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 9. Switching (V = 13V Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 10 ...
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... Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 22 Figure 29. SO-28 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 30. Thermal fitting model of a quad channel HSD in SO- Figure 31. SO-28 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 32. SO-28 tube shipment (no suffix Figure 33. SO-28 tape and reel shipment (suffix “TR” 4/ case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 CC Doc ID 17387 Rev 1 VNQ810P-E ...
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... VNQ810P-E 1 Block diagram and pin description Figure 1. Block diagram GND1,2 INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 GND3,4 INPUT3 STATUS3 OVERTEMP. 3 INPUT4 STATUS4 OVERTEMP OVERVOLTAGE CLAMP UNDERVOLTAGE CLAMP 1 DRIVER 1 CURRENT LIMITER 1 LOGIC OPENLOAD ON 1 OPENLOAD OFF 1 V OVERVOLTAGE cc CLAMP UNDERVOLTAGE CLAMP 3 ...
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... CC GND 1,2 INPUT1 STATUS1 STATUS2 INPUT2 V 1 3,4 CC GND 3,4 INPUT3 STATUS3 STATUS4 INPUT4 V 3 Status N. Doc ID 17387 Rev 1 VNQ810P-E V 1,2 CC OUTPUT1 OUTPUT1 OUTPUT1 OUTPUT2 OUTPUT2 OUTPUT2 OUTPUT3 OUTPUT3 OUTPUT3 OUTPUT4 OUTPUT4 OUTPUT4 V 3,4 CC Output Input X X Through 10 K resistor ...
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... VNQ810P-E 2 Electrical specifications 2.1 Absolute maximum ratings Stressing the device above the rating listed in the the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability ...
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... OUT3 OUTPUT3 V OUT3 I OUT4 OUTPUT4 V OUT4 GND 1,2 I GND3,4 GND1,2 Min. Typ. Max. Unit 5 > ° 3 VNQ810P-E V CC1,2 OUT1 160 m 320 m 40 µA 25 µ µA 0 µA 5 µA 3 µA ...
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... VNQ810P-E Table 6. Protections Symbol T Shutdown temperature TSD T Reset temperature R T Thermal hysteresis hyst Status delay in overload t SDL conditions I Current limitation lim V Turn-off output clamp voltage I demag 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles ...
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... Doc ID 17387 Rev 1 Test conditions Min. Typ. Max 1.5 2.5 IN Min. Typ. Max. 1.25 1 3.25 0.5 6 6.8 - 0.7 OVER TEMP STATUS TIMING T > TSD V INn V STATn t SDL VNQ810P-E Unit 80 mA 200 µs 3.5 V 1000 µs Unit V µ µ SDL ...
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... VNQ810P-E Figure 5. Switching time Waveforms Table 12. Truth table Conditions Normal operation Current limitation Overtemperature Undervoltage Overvoltage Output voltage > V Output current < I Input Doc ID 17387 Rev 1 Electrical specifications Output Sense < ...
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... Doc ID 17387 Rev 1 pin (part 1/3) CC Test levels III IV Delays and impedance - 100V 2ms 100V 0.2ms 150V 0.1µ 100V 0.1µ 100ms, 0.01 + 86.5V 400ms, 2 pin (part 2/3) CC III pin (part 3/3) CC Contents VNQ810P ...
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... VNQ810P-E Figure 6. Waveforms INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT VOLTAGE STATUS n INPUT n OUTPUT VOLTAGE STATUS n INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT VOLTAGE STATUS n Normal operation n Undervoltage V USDhyst V USD n undefined Overvoltage V <V V > Open-load with external pull-up ...
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... Vscl (V) 8 7.8 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 100 125 150 175 -50 Doc ID 17387 Rev 1 High level input current Vin=3.25V - 100 125 Tc (°C) Vstat=5V 0 -50 - 100 125 Tc (°C) Istat=1mA - 100 125 Tc (°C) VNQ810P-E 150 175 150 175 150 175 ...
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... VNQ810P-E Figure 13. Overvoltage shutdown Vov ( -50 - (°C) Figure 15. Turn-on voltage slope dVout/dt(on) (V/ms) 1000 900 Vcc=13V 800 Rl=13Ohm 700 600 500 400 300 200 100 0 -50 - (ºC) Figure 17. On-state resistance vs T Ron (mOhm) ...
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... Figure 22. Open-load off-state voltage Vol (V) 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 100 125 150 175 100 125 150 175 Doc ID 17387 Rev 1 -50 - 100 125 Tc (°C) detection threshold Vin=0V -50 - 100 125 Tc (°C) VNQ810P-E 150 175 150 175 ...
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... VNQ810P-E 3 Application information Figure 24. Application schematic +5V C Note: Channels 3 and 4 have the same internal circuit as channel 1 and 2. 3.1 GND protection network against reverse battery This section provides two solutions for implementing a ground protection network against reverse battery. 3.1.1 Solution 1: a resistor in the ground line (R It can be used with any type of load ...
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... S(on)max GND . GND ) in the ground line GND = 1k ) should be inserted in parallel prot Doc ID 17387 Rev 1 where I becomes the sum of the S(on)max if the device is driving an GND ) in line to prevent prot ) / I GND IHmax VNQ810P-E CC line, CC ...
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... VNQ810P-E Example For the following conditions 100 V CCpeak latchup V 4 prot Recommended values are prot 3.4 Open-load detection in off-state Off-state open-load detection requires an external pull-up resistor (R output pin and a positive supply voltage (V microprocessor. The external resistor has to be selected according to the following requirements: 1 ...
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... Values are generated with R In case of repetitive pulses, T must not exceed the temperature specified above for curves B and C. 20/ 0.1 1 L(mH) = 150 ºC Jstart = 100 ºC Jstart = 125 ºC Jstart Demagnetization Demagnetization = 0 L (at beginning of each demagnetization) of every pulse jstart Doc ID 17387 Rev 1 VNQ810P-E = 13.5V 100 Demagnetization t ...
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... VNQ810P-E 4 Package and PCB thermal data 4.1 SO-28 thermal data Figure 27. SO-28 double island PC board Note: Layout condition of R thickness = 2 mm, Cu thickness = 35 µm, Copper areas: 0.5 cm Table 16. Thermal calculation according to the PCB heatsink area Chip 1 Chip 2 ON OFF R OFF thermal resistance junction to ambient with one chip ON ...
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... T p 22/28 vs PCB copper area in open box free air condition PCB Cu heatsink area (cm ^2)/island 0.01 0.1 1 time( – THtp Doc ID 17387 Rev 1 VNQ810P-E R thA R thB R thC 0,5 cm ^2/is land 3 cm ^2/is land 6 cm ^2/is land One channel ON Two channels ON on same chip 10 ...
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... VNQ810P-E Figure 30. Thermal fitting model of a quad channel HSD in SO- Table 17. Thermal parameters Area / island ( R13 = R15 (°C/ R14 = R16 (°C/ C13 = C15 (W.s/° ...
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... In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.2 SO-28 package information Figure 31. SO-28 package dimensions 24/28 packages Doc ID 17387 Rev 1 VNQ810P-E ® ...
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... VNQ810P-E Table 18. SO-28 mechanical data Symbol Package and packing information Millimeters Min. Typ. 0.10 0.35 0.23 0.50 45° (typ.) 17.7 10.00 1.27 16.51 7.40 0.40 8° (max.) Doc ID 17387 Rev 1 Max. 2.65 0.30 0.49 0.32 18.1 10.65 7.60 1.27 25/28 ...
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... (± 0. (± 0.1/-0) 1.5 D1 (min) 1.5 F (± 0.05) 7.5 K (max) 6.5 P1 (± 0.1) 2 End Top cover tape Doc ID 17387 Rev 1 VNQ810P-E Base Q.ty 28 Bulk Q.ty 700 Tube length (± 0.5) 532 A 3.5 B 13.8 C (± 0.1) 0.6 All dimensions are in mm. Reel dimensions Base Q.ty 1000 Bulk Q.ty 1000 A (max) 330 B (min) 1.5 C (± 0.2) ...
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... VNQ810P-E 6 Revision history Table 19. Document revision history Date 27-Apr-2010 Revision 1 Initial release. Doc ID 17387 Rev 1 Revision history Changes 27/28 ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 28/28 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 17387 Rev 1 VNQ810P-E ...